| DDR
Compared to DDR2 |
| Features/Options |
DDR |
DDR2 |
DDR2
Advantages |
| Modules |
184-pin
unbuffered, registered / 200-pin SODIMM / 172-pin MicroDIMM |
240-pin
unbuffered, registered / 200-pin SODIMM, 214-pin MicroDIMM |
Modules
are the same length, with added pins |
| Package |
TSOP:
66-pins |
FBGA
Only |
Enables
better electrical performance and speed |
| Voltage |
2.5V
/ 2.5V I/O |
1.8V
/ 1.8V I/O |
Reduces
memory system power demand |
| Densities |
128MB
- 1GB |
256MB
- 4GB |
High-density
components enable large memory subsystems |
| Internal
Banks |
4 |
4
and 8 |
1GB
and higher DDR2 devices will have 8 banks for better
performance |
| Pre-Fetch
(MIN Write burst) |
2 |
4 |
Provides
reduced core speeds dependency for better yields |
| Speed
(data pin) |
200,
266, 333, 400 |
400,
533, 667 |
Migration
to higher speed IO |
| Read
Latency |
2,
2.5, 3 CLK |
CL
+ AL / CL =(3,4,5) |
Eliminating
one-half clock helps speed internal DRAM logic and improves
yields |
| Additive
Latency |
N/A |
AL
options (0,1,2,3,4) |
Mainly
used in Server applications to improve command bus
efficiency |
| Write
Latency |
1
clock |
read
latency -1 |
improves
command bus efficiency |
| Termination |
Motherboard
parallel to Vtt |
DRAM
on-die termination (ODT) - optional onboard termination |
ODT
for both memory and controller improves signaling and
reduces system cost |
| Data
Strobes |
Single-ended |
Differential
or single-ended |
Improves
system timing margin by reducing strobe cross-talk |