Supermicro's RoHS Compliance
Supermicro is fully committed to comply with all applicable laws and regulations, including the RoHS Directive which restricts the use of certain hazardous materials in electrical and electronic products. Supermicro's goal is to meet and exceed compliance obligations of the RoHS Directive on a global basis. By July 1, 2006, RoHS substances will be virtually eliminated (to levels below legal limits) for all newly marketed Supermicro products subject to the RoHS Directive, except where it is widely recognized that there is no technically feasible alternative (unless otherwise exempted under the RoHS directives).
Supermicro RoHS Labelling RoHS Compliance Levels
RoHS 5/6 RoHS 5/6 is equivalent to RoHS compliance with Server Exemption
RoHS 6/6 RoHS 6/6 is equivalent to Full RoHS compliance, Pb Free
Currently Supermicro provides the following RoHS compliant products.
RoHS is not 100% Lead Free
Certain Supermicro servers, storage and storage array systems, server boards, network infrastructure equipment for switching, signaling, transmission as well as network management for telecommunications are RoHS compliant or have the appropriate exemptions. RoHS compliance does not mean RoHS restricted substances are not present but, in general, do not exist as homogeneous materials and may not be present in Supermicro products in quantities greater than the limit of 0.1% (1000 PPM) or where application specific exemptions exist for the following:
  • Lead and its compounds
    • (other than lead in solder and in component package lead / ball terminations)
    • Exempted (Leaded glass used in cathode ray tubes, electronic components and fluorescent tubes)
    • Exempted (Lead in Steel - 0.35% or 3500 PPM)
    • Exempted (Lead in Aluminum Alloys - 0.4% or 4000 PPM)
    • Exempted (Lead in Copper Alloys including bronzes, brasses, 4% or 40KPPM)
    • Lead carbonates and sulfates must not be used in any paint applied to parts, components, materials or products, 0.01% 100 PPM or less.
    • Lead in PVC coating for internal or external cable, wire and cords (less than 0.03% or 300 PPM)
    • Exempted (Lead in high melting temperature type solders, i.e. tin-lead solder alloys containing more than 85% lead)
    • Batteries (less than 0.01% or 100 PPM)
    • Exempted (Lead in electronic ceramic parts, e.g. piezo electronic devices)
    • Packaging Materials (May not contain any amount of lead as an intentionally added element (0.01% or 100 PPM or less)

     

  • Mercury
    • Exempted (scanner bulbs, projector lamps, backlit displays or LEDs)
    • Packaging Materials (May not contain any amount of mercury as an intentionally added element (0.01% or 100 PPM or less)

     

  • Hexavalent Chromium and its compounds (no more than 0.01% or 100 PPM)
    • Non-Metallic Applications (Paints, Pigments, and Plastics)
    • Metallic Applications (Corrosion preventative coatings, conversion coatings)
    • Packaging Materials (May not contain any amount of hexavalent chromium and its compounds as an intentionally added element (0.01% or 100 PPM or less)

     

  • PBBs or PBDEs
    • (flame-retardants must not be contained in plastic parts, components, materials and products in greater than 0.1% or 1000 PPM)
    • Packaging Materials (May not contain any amount of bromine based flame retardants as an intentionally added element (0.01% or 100 PPM or less)

     

  • Cadmium and its compounds
    • (No more than 0.01% or 100 PPM)
    • Packaging Materials (May not contain any amount of cadmium as an intentionally added element (0.01% or 100 PPM or less