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Sept. 2006 |
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Volume 5 / Issue 4 |
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Downloadable Version (.pdf format)
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In This Edition: |
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Welcome to
another edition of the ASI Technical Newsletter! This
newsletter features articles on the latest computer technologies and
products offered by ASI CORP, a leading North American Distributor
of computer components and whitebox systems. We are focused on
helping our resellers and system builders be able to offer the very best
technology solutions and this newsletter is a free tool so you can
learn about current and next generation products. If you are an ASI customer feel free to call
our Technical Support Staff if you have any questions or visit
www.asisupport.com (general technical help),
www.asiserver.com (server solutions) or
www.asimobile.com (notebooks) for further information. Thank you.
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Overview
On July 27th, Intel announced the
Intel® Core™2 Duo (C2D) and Intel®
Core™2 Extreme (C2E) processors, which are the new
brand names for Intel's next-generation of
energy-efficient performance oriented desktop
processors. Formerly known by the codename "Conroe," the
Intel® Core™2 processors for desktop computers are based on
the
Intel® Core™ microarchitecture, Intel's new
industry-leading foundation for all mobile, desktop and
server platforms moving forward. These processors include
two processing cores per chip, hence the “Duo” addition.
These ground-breaking processors are built on Intel’s
advanced 65-nanometer design and manufacturing process
technology that shrinks a processor’s circuitry and
transistors.
This combination will deliver
higher-performing, yet more energy-efficient processors that
will spur more capable, stylish, silent and smaller mobile
and desktop PCs while saving on electricity usage.
Intel is touting the C2D to deliver up to a 40% increase in
performance while consuming 40% less electricity when
compared to the Pentium D 960 processor. To quote Intel CEO
Paul Otellini, "The Core™2 Duo processors are
simply the best processors in the world. Not since Intel
introduced the Pentium® processor has the industry seen the
heart of the computer reinvented like this. This is
not just an incremental change; this is a revolutionary
leap." Otellini also said that with the debut of the
C2D, Intel has definitely regained the performance crown
from AMD, and early reviews of the Core™ 2 Duo have been
simply stellar with performance gains as high as 70% over
the AMD AM2 on CPU-bound benchmark tests. Otellini also
predicted that the "Core™ 2 Duo is the growth
engine for the next 500 million new internet users."
Brand
New and Improved
Starting with these two new Intel® Core™2 Duo and Intel®
Core™2 Extreme brands, the “2” designation signals the
arrival of a new generation of technology to the Intel®
Core™ processor line. The first "Core™" processor debuted in
Q1 in the form of the Core™ Duo mobile processors, but the
Core™ 2 line adds a bevy of new features to enhance
performance and reduce power consumption. You will see these
new mobile Core™ 2 Duo processors code-named "Merom"
starting to trickle into ASI warehouses in the September
timeframe. In order to be consistent with current Intel
Core™ processor naming, Intel will continue to use such
terms as “Duo” to effectively indicate the number of
processing cores per product.
These two new brands will
have new logos (can be seen below) which are consistent with
the new Intel brand and corporate identity introduced
earlier this year, yet visually distinctive in both design
and coloring, to help easily identify these powerful
state-of-the-art products as new and improved. These new
dual-core processors for the desktop will include the
industry’s largest integrated cache called
Intel® Advanced Smart Cache
(either 4MB or 2MB) that includes a unique design for faster
performance on memory intensive applications. These products
will also support such features as enhanced security,
virtualization and manageability built right into the
processors.
These desktop Core™
2 Duo processors will mark the arrival of Intel's cleanest
dual-core design to date. Intel's existing 9XX and 8XX
dual-core processors use two distinct cores, which
communicate with each other over the front-side bus. In
contrast, Conroe will have its two cores on the same silicon
die (monolithic design), enabling faster inter-processor
communication and a shared L2 cache to radically enhance
performance.
Core™2
Duo processors E6000 Family (E6300 - E6700)
The basic Core™
2 Duo family will consist of four processors: the E6300,
E6400, E6600, and E6700. They will run at clock speeds of
1.86 GHz, 2.13 GHz, 2.40 GHz, and 2.66 GHz, respectively.
The E6300 and E6400 will be equipped with a 2MB L2 cache;
the other two models will have a 4MB L2 cache. Using Intel's
65 nm manufacturing technology, all come with a 1,066-MHz
front-side bus, and will ack 291 million transistors onto a
143 square-millimeter slice of silicon.
ASI
SKU |
Processor
Number |
Clock
Speed |
Cache
Size L2 |
Front
Side Bus |
Dual
Core |
Intel®
VT |
EIST |
Intel®
EM64T |
Execute
Disable Bit |
sSpec# |
Package |
|
50171 |
E6700 |
2.66 GHz |
4MB |
1066MHz |
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SL9S7 |
LGA 775 |
|
50170 |
E6600 |
2.40 GHz |
4MB |
1066MHz |
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SL9S8 |
LGA 775 |
|
50169 |
E6400 |
2.13 GHz |
2MB |
1066MHz |
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SL9S9 |
LGA 775 |
|
50168 |
E6300 |
1.86 GHz |
2MB |
1066MHz |
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SL9SA |
LGA 775 |
Core™
2 Extreme Edition X6800
At the top
of the line, the Core™
2 Extreme processor is being aimed for gaming systems and
graphics workstations. It's designated as the X6800 with a
clock speed of 2.93 GHz, and gives you the ability to change
the clock multiplier in able to push the performance
envelope even further. This is the first Intel processor to
officially have an un-locked clock multiplier where you can
carefully overclock your system greater than the 11:1 stock
clock multiplier ratio.
Later in Q4 the next C2E will
arrive as a quad-core desktop processor code-named
"Kentsfield" and will surely keep Intel the performance
leader on the desktop.
ASI
SKU |
Processor
Number |
Clock
Speed |
Cache
Size L2 |
Front
Side Bus |
Dual
Core |
Intel®
VT |
Enhanced
Intel
SpeedStep®
Technology |
Intel®
EM64T |
Execute
Disable Bit |
sSpec# |
Package |
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50918 |
X6800 |
2.93 GHz |
4MB |
1066MHz |
 |
 |
 |
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SL9S5 |
LGA 775 |
Intel Core™ Microarchitecture:
Energy-Efficient Performance
Back at Spring
IDF in early March, Intel announced their
new
Core™
micro-architecture, replacing
the long-in-the-tooth Netburst®
architecture design, which finally hit its thermal wall so
to speak. Netburst® had a nice
five year run but Intel could never get past 3.8GHz due to
the resulting excessive heat, which couldn't be adequately
dissipated by the cooling subsystem. Enter the Core™
micro-architecture, an evolutionary offshoot of the
Pentium M mobile processor design, which puts a major
emphasis on lowering power consumption along with Intel's
older priority of boosting performance. Intel had to
radically move away from its dependence on rising clock
frequencies or "digital narcotics" as we've jokingly called
it, to achieve their performance gains. In the past few
years Intel added their "T's" or technologies to their
processors, like Hyper-Threading, XD, EM64T, EIST, & VT, to
enhance performance without raising the clock frequency. The
last trick they had left was to add a 2nd core to the mix to
increase performance and lower the clock speed, but
excessive thermals again proved to be the roadblock of the
Netburst®
architecture.
To confirm just how important it was for Intel to create
such an energy-efficient new processor architecture I think
these comments made by Intel Chief Technology Officer Justin
Rattner at Spring IDF say it all. "Energy is on everyone's
mind. It's the next frontier. Not only has it become a
critical concern in our daily lives, it's become a critical
concern in just about every platform we have. The amount of
energy required to execute a single instruction has
increased significantly, well over a factor of four over
this time frame. (~13 years)." In 2001
Netburst® (Pentium 4) debuted and had about four
times the performance of the original Pentium (1993), but it
consumed about 3.5 times the energy per instruction. In 2003
Centrino Mobile Technology arrived with the Pentium M
lineage of chips and changed this trend and Intel's way of
thinking for all future chip generations. The Pentium M
(Banias) consumed the same amount of energy per instruction
as the original Pentium but has about 3 times the
performance. The Core™ Duo, which came to market in Q1 of
this year, has four times the performance and even lower
per-instruction consumption than the Pentium M.
The Core™ micro-architecture
utilizes a much shorter 14-stage processing pipeline where
the workload is divided up in chunks. The Pentium 4 was
designed with a very deep 31-stage pipeline. The Pentium M
and Core Duo have a slightly shorter 12-stage pipeline. The
Core™ micro-architecture is also "wider" with the ability to
process four instructions per clock cycle versus prior Intel
and AMD generations that can only crunch 3 instructions at
the same time. The new Core™ 2 Duos can also process a
single 128-bit SSE (Streaming SIMD [Single Instruction
Multiple Data] Extension instruction every clock cycle where
Pentium 4 and Athlon 64 take two clock cycles. Being able to
process these SSE, SSE2 & SSE3 instructions faster substantially speeds up media encoding and transcoding
applications .
The Core™
micro-architecture also is able to combine processor
micro-ops (decoded x86 instructions) and macro-ops (two
combined x86 instructions) into one data item and sent
through the pipeline in a single cycle, thus effectively
issuing 5 instructions per clock cycle in a lot of
instances.
Also the Core™ 2 Duos are designed in a "monolithic" fashion
where both cores reside on the same die. Because of this
design the two cores can access up to a 4MB pool of L2 Cache
without having to go out across the very slow front-side
bus. This L2 Cache can also be allocated on the fly
depending on the task at hand, and if one core is busy it
can utilize and access the entire 4MB pool of cache. The
cache prefetching routines are also greatly improved, so
cache misses are a rarity since the L2 caches are constantly
providing the needed data without having to go out to main
memory. Intel notes that these prefetching routines are so
efficient that main memory latency and bandwidth issues are
a thing of the past, and the front-side bus hardly ever gets
saturated to impact performance.
Core™
Microarchitecture - Main Features:
• Intel Wide Dynamic
Execution
delivers more
instructions per clock cycle as compared to the Netburst®
micro-architecture with a 33% wider execution pipeline
allowing each core to execute and complete up to 4 full
instructions simultaneously in a single tick of a chip's
clock. In addition, two features named micro-op fusion and
macro-fusion automatically combines two high-level chip
instructions, in some cases into a single instruction, so
the Core™ 2 Duo's can effectively issue 5 instructions per
clock cycle as compared to the Pentium 4/Pentium D and AMD
Athlon 64 families which can only process 3 instructions per
clock tick.
• Intel
Advanced Smart Cache
includes a shared and multi-core optimized L2 cache that
improves performance by dynamically allocating cache to each
core depending on workload. Improves how high-speed cache
memory is shared by multiple processor cores. For example,
it lets one core control the whole cache when the other core
is idle, and for other times, it governs how the same data
can be shared by both cores.
• Intel
Smart Memory Access
is an improved set of algorithms that can predict what data
should be "prefetched" from main memory into faster cache
memory so it's at hand when the processor needs it. Improves
performance by using advanced data pre-fetch algorithms that
help hide system-memory latency effects. This is also known
as memory disambiguation logic and it is great at correctly
predicting the order of events and can execute the second
instruction before the first one has completed.
• Intel
Advanced Digital Media Boost
means all "SSE" instructions can execute in a single clock
tick. Prior processor families took two clock cycles to
process this data. SSE stands for Streaming SIMD (single
instruction, multiple data) Extensions and speeds several
operations such as video decoding or digital photo
processing. Effectively doubles the execution speed for many
of the 128-bit SSE/2/3 instructions commonly used in
multimedia and graphics applications.
• Intel
Intelligent Power Capability
allows the electrical shut down of portions of the chip that
aren't needed at a particular time to support instruction
execution. Optimizes power consumption by intelligently
powering on processor-computing elements only when required.
|
Feature
|
Function
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Benefit
|
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Intel® Wide
Dynamic Execution
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Executes 4
instructions per clock cycle vs. 3 per clock
with Intel Netburst®,
Intel Pentium M andAMD micro-architectures
|
Better
performance on multiple application types and
user environments on single and multithreaded
apps:
- Digital video-editing
- Content creation
- Entertainment / gaming•
- Productivity
- Scientific calculations
|
|
Intel®
Advanced Smart Cache
|
Increases
efficiency of L2 cache to processor core data
transfers
•
Entire L2 cache can be allocated to one core
(vs. dedicated L2 for each core in Pentium D
and AMD dual-cores)
|
|
Intel® Smart
Memory Access
|
Efficiently feeds
data into Intel's Wide Dynamic Execution engine
•Maximizes
main memory to processor bandwidth and
reduces latency
|
|
Intel® Advanced
Digital Media Boost
|
Allows 128-bit
SSE/2/3 instructions to execute in a single
clock cycle
•Same
instructions execute in 2 cycles on Intel
Netburst®
, Intel mobile and AMD micro-architectures
|
Better
performance on apps that use SSE instructions:
-
•
Video, speech, gaming, multimedia,
photo processing
-
•
Encryption, financial
-
•
Engineering, scientific
|
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Intel®
Intelligent Power Capability
|
•Conroe
65W desktop mainstream TDP, Woodcrest 80W server
mainstream & 40W ultra dense TDP
•Continued
low power mobile platform w/ "Merom" in Q4
|
Can help enable
quieter, more power and
efficient system designs
Can help reduce
overall power consumption
|

Better
Acoustics
Intel Core™ 2 Duo
processors are equipped with a new Digital Thermal Sensor
(DTS) that enables efficient processor and platform thermal
control. Thermal sensors located with the processor measure
the maximum temperature on the die at any given time. Intel®
Quiet System Technology, included in the Intel® 965 Express
Chipset family, uses the DTS to regulate the system and
processor fan speeds. The acoustic benefit of temperature
monitoring is that system fans spin only as fast as needed
to cool the system, and slower spinning fans generate less
noise.
Platform Support
A platform based on
the Intel® 965 Express Chipset family (P965, G965 & Q965)
with an optimized DDR2-800 memory engine for improved system
performance, is the ideal compliment for the Intel Core™ 2
Duo processor. New and enhanced technologies in the area of
Intel integrated graphics found in the G965 chipset (X3000),
improved HD 8-channel sound, 6 onboard SATA 3G ports with
options for RAID 5, up to 10 USB 2.0 ports and extensive
desktop manageability found in the Q965 chipset adds an
array of capabilities to the new platform for the rest of
2006 and well into 2007. This new combination of processor
and chipset brings an unparalleled level of performance to
the desktop. These new Intel chipsets will be covered in
another ASI technical document up on our
ASI/Intel Technical Resource Center, and seen in the
September '06
ASI
Technical Newsletter.
Motherboards:
Because the Core™2 Duo and Core™2 Extreme
processors use less power than the prior generations, like
the Pentium 4/Pentium D processors, a motherboard's voltage
regulator module (VRM) has to support the lower voltage of
these new Core™ 2 Duo processors in this voltage range:
0.850V-1.3525V. Also, besides the Intel 965 chipset
family based boards, motherboards using other Intel (975X,
946), and non-Intel chipsets (nVidia 590/570) for example
are available with the correct voltage regulation down on
the board to support the reduced core voltage of the Core™ 2
Duo processors. Older revisions of motherboards now being
used in the field using the 975X chipset, such as Intel's
D975XBX board, might not have the correct VRM circuitry to
support the Core™ 2 Duos. Other MBs based on older chipsets
like the 865G, 915 and 945 for example can still support the
Conroe processors if the correct VRM circuitry is integrated
onto the board. Because of this confusion over which MBs and
which of their revisions support the C2Ds, we created a
chart with all the MBs we currently resell that support the
Core™ 2 Duos to make it easier for our sales reps and
customers =>
Core™
2 Duo MB Support Chart.
Chassis:
Intel thermal specifications
require the use of a
Thermally Advantaged Chassis (TAC) version 1.1
when integrating an Intel® Core™2 Duo Processor
into your system. A "TAC"
is
designed to maintain an internal ambient chassis temperature
below 38oC to help aid in keeping the processor's
core temperature below its maximum
Thermal Design Power (TDP), also referred to as Thermal
Guideline. This is the maximum amount of heat which a
thermal solution must be able to dissipate from the
processor, so that the processor will operate under normal
operating conditions.
A TAC
version 1.1 chassis
is
defined by the presence of an
80mm side-panel air duct, a 92mm rear chassis fan and
side-panel venting holes above the graphics and add-in card
slots to provide additional cooling for high-end PCI Express
graphics and other peripherals. One great benefit of using
the Core™
2 Duos with their 65W power envelope is the ability to
assemble much quieter and cooler systems in smaller form
factors such as picoBTX and nanoBTX. These unique compact
systems are showing up in numerous vertical markets and used
as the main Media Center server or extender device
throughout the digital home. Contrast these compact systems
with ones built using Pentium 4 processors with their 115W
TDP, Pentium D with 95W and the Pentium Processor Extreme
with 130W, which all translates to larger, noisier, and less
energy efficient systems.
To view
Intel's Thermally Advantaged Chassis list =>
Click Here
Power Supply:
Intel highly recommends an
ATX12V version 2.2
power supply for use with both the Core™2 Duo
(65W) and Core™2 Extreme (75W) processors. Please check
www.intel.com/go/powersupplies for the appropriate
support and validated power supplies. But please only use
this chart as a guideline, since your particular system
configuration will dictate the total wattage needed to run
your system reliably. For a basic system using onboard
graphics, Intel recommends a power supply in the 250-450W
range and I would err towards the high-end unless you're
using a very small footprint chassis. For a system with a
discrete PCI Express x16 video card, Intel recommends a
power supply in the 450-600W range, and if you employ two
high-end 7950GX2s in SLI with multiple hard drives, you
might even consider going with a 700W power supply.
Heatsink (Boxed
Core™ 2 Duo Heatsink Fan Info)
The Intel® Core™2 Duo
processors E6700, E6600, E6400, and E6300 ship with a
FCLGA4-L fan-heatsink with an Intel part number of
D60188-001. Some things to know about this fan-heatsink are
the following:
This ATX thermal solution was
designed for and should only be used with desktop Intel®
Core™2 Duo processors rated at a Thermal Design Profile of
65W.
- It is not backward
compatible with any Pentium® 4 or Pentium® D processor
fan-heatsinks and should not be used on Pentium® 4 or
Pentium® D processors.
- You should also not use
the older Pentium® 4 or Pentium® D boxed processor
fan-heatsinks on desktop Intel® Core™ 2 Duo processors.
This fan-heatsink is RoHS
compliant.
This fan-heatsink utilizes a
new TC-1996 Thermal Interface Material (TIM). Intel will be
offering the TIM replacement in a syringe for the Intel®
Core™2 Duo and Intel® Core™2 Extreme processors. Be sure to
clean the fan-heatsink and processor integrated heat
spreader of any debris or previous applied material prior to
reapplication of the TIM.
- You may order TIM
replacement kits through Intel Customer Support. The
Intel part number is D54816-001. For contact information
for your region,
click
here.
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New Intel Desktop Chipsets
The P965, G965,
and Q963 Express Chipsets |
| Earlier this
year, at Computex, Intel introduced it's first
Broadwater chipset the P965 Express. Designed
with the Core 2 Duo processor in mind, the P965
chipset introduced some new technologies that
are slowly making their way across most of
Intel's incoming chipsets. These technologies
are: Fast Memory Access (FMA): This new
technology significantly optimizes the available
memory bandwidth usage and reduces memory access
latency.
- Maximizes memory bandwidth utilization
- Reduces memory latency
- Improves system performance
Quiet System Technology (QST):
Utilizes the Digital Thermal Sensor (DTS)
embedded inside of the Core 2 Duo processors to
regulate the system and processor fan speeds.
This
completely controls the fan speed in order to
insure that they only spin as fast as necessary
to keep the system running at it's optimum
performance temperatures and so that you get the
quietest computing experience possible.
Flex Memory Technology (FMT): Allows
users more flexible upgrade options for their
memory by allowing them to upgrade their PC
using different sized memory modules while still
retaining the ability to run in dual channel
mode for speed enhancement.
USB Port Disable: Previously only
available as a registry hack, this new added
technology allows individual USB ports to be
enabled or disabled as needed. This provides
added security by preventing data transfer
through the USB ports to or from external
devices.
Clear Video Technology (available only on
the G965 and Q963 Express Chipsets):
Designed with the home user in mind, this
technology enhances video playback through
advanced digital processing.
- Enhanced high-definition video playback
- Sharper images
- Precise color control
- Advanced display capability
|
Chipset |
 |
 |
 |
|
Target Segment |
Performance PC,
Mainstream PC |
Mainstream PC |
Mainstream PC |
|
Socket |
Socket T (LGA775) |
Socket T (LGA775) |
Socket T (LGA775) |
CPUs
Supported |
Core 2 Duo processor w/ VT,
Pentium D processor 900 Series
Pentium 4 processor w/ HT Technology |
Core 2 Duo processor w/ VT,
Pentium D processor 900 Series
Pentium 4 processor w/ HT Technology |
Core 2 Duo processor w/ VT,
Pentium D processor 900 Series
Pentium 4 processor w/ HT Technology |
Hyper-Threading
Support |
Yes |
Yes |
Yes |
FSB
Support
(MHz.) |
1066 / 800 / 533 |
1066 / 800 / 533 |
1066 / 800 / 533 |
Memory
Type |
Dual Channel DDR2
800/667/533 (up to 12.8GB/s) |
Dual Channel DDR2
667/533 |
Dual Channel DDR2
667/533 |
Max
Memory |
8GB |
8GB |
8GB |
Integrated
Video |
N/A |
Intel
GMA X3000
w/ Intel Clear
Video Technology |
Intel
GMA X3000
w/ Intel Clear
Video Technology |
External
Video |
PCI-Express
X16 Graphics port |
PCI-Express
X16 Graphics port |
DID, ADD2, DVI |
PCI-E
X1 |
6 |
6 |
6 |
|
SATA |
6
(3G)
Optional Intel
Matrix Storage
Technology |
6
(3G)
Optional Intel
Matrix Storage
Technology |
6
(3G)
Optional Intel
Matrix Storage
Technology |
|
USB |
8 USB 2.0 Ports;
Dual EHCI: USB disable |
10 USB 2.0 Ports;
Dual EHCI: USB disable |
10 USB 2.0 Ports;
Dual EHCI: USB disable |
|
Networking |
Optional Intel
GbE LAN |
Intel Integrated
10/100/1000 |
Intel Integrated
10/100/1000 |
|
Audio |
Intel High
Definition Audio |
Intel High
Definition Audio |
Intel High
Definition Audio |
|
Viiv Support |
Yes* |
Yes* |
Yes* |
Other
Features |
Intel Quiet
System Technology,
Intel Fast
Memory Access,
Intel Flex
Memory Technology,
USB Port Disable |
Intel Quiet
System Technology,
Intel Fast
Memory Access, |
Intel Quiet
System Technology,
Intel Fast
Memory Access,
Intel Stable
Image Platform,
Intel Flex
Memory Technology,
USB Port Disable |
RoHS
Compliant |
Yes |
Yes |
Yes |
*While combined with a Viiv
capable SouthBridge chip
Motherboards
featuring these chipsets are being released by
ASUS, Gigabyte, Intel (of course), and Foxconn.
ASI has begun stocking these boards in multiple
locations to insure speedy delivery to it's
customers.
| |
P965
Chipset
|
G965
Chipset
|
Q963
Chipset |
 |
- P5B (SKU
51062)
- P5B Deluxe
- P5B Deluxe / WiFi-AP
(SKU 51061)
|
|
N/A |
 |
- GA-965P-S3
(SKU 51773)
- GA-965P-DS3
(SKU 51131)
- GA-965P-DS4
- GA-965-DQ6
(SKU 51128)
|
N/A |
N/A |
 |
|
- DG965WHMKR
(SKU 50733)
- DG965RYCK
(SKU 50739)
- DG965MSCK
(SKU 50741)
- DG965SSCK
(SKU 50737)
- DG965OT
(SKU 50735)
- DG965MQMKR
(SKU 50731)
|
|
 |
- P9657AA-8KS2H
- P9657AA-8EKRS2H
|
N/A |
N/A |
|
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|
Nvidia GeForce
7950GX2
The
Power of SLI in One Video Card |
 |
| o'ver-kill'
vt. destroy with more force than required; n.
NVIDIA® seems to have borrowed the dictionary
definition of this term while creating it's newest product, the NVIDIA®
GeForce® 7950 GX2 dual GPU graphics card. NVIDIA has essentially created
a card with so much power that the vast majority of the games on the
market can not even take full advantage of it in single card SLI mode.
When you consider the graphics power available with dual cards in
Quad-SLI mode, NVIDIA has raised the bar on high-end graphics to an
almost unobtainable level for it's competition.
While many enthusiasts enjoy high-end
gaming systems, many of them also lack dual VGA slot SLI capable
motherboards. NVIDIA is here to save the day once more with SLI graphics
in a single card. Instead of installing dual graphics cards in your
system you can now install 1 PCI Express card which essentially has 2
GeForce 7900 GT cards bolted together. Instead of the standard 450MHz.
core clock of the 7900 GT cards and the 7900 GX2 SLI cards before it,
(which were available to specific system builders only), each of the the
7950 GX2 cores run at 500MHz clock speed. With 1.2GHz. of effective RAM
speed, and 1GB total memory on the 7950 GX2, nothing else in it's class
even comes close.
The new card was designed with the DIY
market in mind and suffers from very few (if any) of the issues of the
7900 GX2. The price of the prior generation dual GPU card was
prohibitively expensive, much of the time fetching more than $1k due to
it's lack of availability except in the Tier 1 OEM market, the new 7950
GX2 can generally be found for less than $600 and is readily available
in stores and on-line.
The days of having to spend four to five
thousand dollars on a custom-built system from a recognized builder in
order to get a quad-SLI setup are over. Also over are the days of
needing specialized motherboards with the NVIDIA nForce4 SLI chipset.
NVIDIA has removed this requirement with the 7950 GX2 and now pretty
much any motherboard with a PCI-E X16 slot that can communicate with the
7950 GX2's PCI-E switch should be able to handle this card with little
more than a BIOS upgrade and making sure that you're running at least
version 91.45 of NVIDIA's ForceWare Drivers (Driver
Link Here).
Primary
changes between the 7900 GX2 and the 7950 GX2 (besides price and
availability), include the physical design of the card. The original
7900 GX2 which was on display at CES was a beast. Over 12" long and
requiring dual PCI-E power cables to run it (one to each PCB), the 7950
is a more standard 9" in length leaving much more room inside your case
for other necessities like hard drives and power to this card is handled
via a single PCI-E video card power connector.
The cooling solution has changed on the
7950 GX2 as well. The 7900 GX2 had a rather bulky and noisy fan solution
which rivaled a dust-buster when the gaming action got hot and heavy.
The new solution on the 7950 GX2 is a much quieter and thinner dual fan
/ heat sink solution which keeps both GPUs relatively cool at all times
while remaining quieter than many single GPU cards available on the
market today. NVIDIA has also removed one of the SLI links which was on
the 7900 GX2 cards. It's unclear how they went from requiring 2 SLI
connectors to run in Quad-SLI mode down to 1 connector, but NVIDIA
assures us that no performance was sacrificed and no animals were harmed
in the process.

In addition to everything else, NVIDIA
continues to push into the home entertainment market by requiring that
all of their board partners on the 7950 GX2 make their card HDCP
compliant by adding the crypto-ROM chip which is required to protect
high-definition content. Not that we think that many 7950's are going to
find their way into Media Center machines, but this is a good precedent
to set, and hopefully all of their cards going forward will have this
feature as well. The future is high-def everything, NVIDIA would do well
to make sure that everything it produces complies and allows it's
customers to progress with the times.
A technical specification comparison of
recent cards from both NVIDIA and ATI is below as well as ASI product
SKUs for the 7950 GX2. While the numbers are impressive by themselves,
seeing the card in action is much more so.
Technical Specifications and
Performance
| |
GeForce 7950 GX2 |
GeForce 7900 GTX |
GeForce 7900 GT |
Radeon X1950XTX |
Radeon X1900XTX |
| Graphics
Bus Technology |
PCI Express |
PCI Express |
PCI Express |
PCI Express |
PCI Express |
| Memory |
1GB (512MB per GPU) |
512MB |
256MB |
512MB |
512MB |
| Memory
Interface |
512-bit (256-bit x2) |
256-bit |
256-bit |
256-bit |
256-bit |
| Memory
Bandwidth (GB/sec) |
76.8 |
51.2 |
42.2 |
64 |
49.6 |
| Fill Rate
(Billion pixels/sec) |
24 |
15.6 |
10.8 |
12 |
10.4 |
|
Vertices/second |
2 Billion |
1400 Million |
940 Million |
1.25 Billion |
1.3 Billion |
| Pixels per
clock (peak) |
48 |
24 |
24 |
48 |
48 |
| RAMDACs
(MHz) |
500 |
650 |
450 |
650 |
650 |
ASI Product SKU Numbers
|
ASI SKU |
Manufacturer |
Card |
Product Page |
|
49641 |
ASUS |
EN7950GX2/2PHT/1G |
Click Here |
|
49337 |
BFG |
GeForce 7950 GX2
(BFGR7950GX21GBE) |
Click Here |
|
49597 |
eVGA |
e-GeForce 7950
GX2 (01G-P2-N592-AX) |
Click Here |
|
49528 |
Gigabyte |
GV-3D1-7950-RH |
Click Here |
|
49472 |
MSI |
NX7950GX2-T2D1GE
(MS-V801-065) |
Click Here |
|
49594 |
XFX |
GeForce 7950 GX2
M570 1GB DDR3 XXX (PVT71UZDD9-7950GX2) (570MHz) |
Click Here |
|
49595 |
XFX |
GeForce 7950 GX2
M520 1GB DDR3 Extreme Edition (PVT71UZDF9-7950GX2) (520MHz) |
Click Here |
As awesome as this card is, there are
still a few issues which are in the process of being worked out, most of
them not within NVIDIA's control. Microsoft's DX9 is not fully prepared
to handle the capabilities of the 7950 GX2 card (especially while
running in a Quad-SLI configuration. The way DX9 limits the number of
back buffers that can be queued, along with it's inability to correctly
push 4x AFR somewhat limits your experience, but Microsoft has been busy
assuring NVIDIA that the problems have been corrected in the impending
release of DX10 (Direct X X?).
In the end, if you're a serious gamer
looking for a serious card, this is the one (or ones) that you want.
NVIDIA has brought to the table a card which is currently unbeatable and
in addition is expandable with a second unit to make its domination
unquestionable. |
|
|
 |
|
AMD
Socket AM2
Processor
Review |
|
Revised
Desktop Lineup Provides New Options for System
Builders |
| Recently hitting the
market, the AMD Socket AM2 processors are the
next generation of cost effective, high
performance CPU from Intel's #1 competitor.
The Socket AM2 (originally
called M2) processors are not based upon an
entirely new architecture but rather features an
updated core (REV F2) of the Athlon 64,
Athlon
64 X2 (dual core), Sempron 64, and FX processor
lines with certain improvements and a few new
models thrown into the mix. This is probably the
last major update before their entirely new core
architecture is released next year.
The first and
most obvious change is the socket. The AM2
socket has 940 pins but is not backwards or
forwards compatible with Socket 940 Opteron
processors. You must purchase the new line of
AM2 socket motherboards available from all major
brands (see chart below). The heatsink retention
mechanism has been updated meaning some
third-party K8 AMD heatsinks will not be
compatible but "Lighter
weight (and AMD retail heatsinks) that clip onto
the socket 754/939/940 heatsink retention frame
center tabs will continue to be compatible with
the socket AM2 heatsink retention frame" -
source (Frosty Tech article).
The biggest
innovation is the fact that AMD replaced the
integrated DDR1 memory controllers with DDR2
memory controllers, opening up memory
bandwidth. Single
core will be able to handle up to 667MHz DDR2,
while the AMD Athlon FX-62 version (ASI SKU#
47221) will be able to support up to 800MHz DDR2
modules.
Another key
advancement is that Socket AM2 solutions provide
lower heat dissipation and power consumption
than their Socket 939 counterparts while still
using a 90nm SOI (silicon on insulator)
process technology. As an example the single
core Athlon 64 3800+ reduces maximum heat
dissipation from 89W to 62W - a 30% decrease.
Simply put this equals more performance per
watt. With less heat Revision F2 processors also
mean potentially quieter systems with longer
life and lowered energy costs. |
Revision F2 core up close using x-ray vision!
This is an Athlon 64 X2. |
| What about
chipsets and motherboards? Nvidia chipsets leads
the way with a few offerings from VIA
technologies. We will take closer look at those
below after checking out the processor lineup. |
|
AM2 Processor Comparison Chart |
|
ASI SKU |
Model |
Cores |
Core Speed |
L2 Cache |
Thermal Power |
|
47221 |
Athlon 64 FX-62 |
dual
core |
2800 MHz
|
2x 1MB |
125W |
|
47220 |
Athlon 64 X2 5000+ |
dual
core |
2600 MHz |
2x 512KB |
89W |
|
47219 |
Athlon 64 X2 4800+ |
dual
core |
2400 MHz |
2x 1MB |
89W |
|
47218 |
Athlon 64 X2 4600+ |
dual
core |
2400 MHz
|
2x 512KB
|
89W |
|
47217 |
Athlon 64 X2 4400+ |
dual
core |
2200 MHz |
2x 1MB |
89W |
|
47216 |
Athlon 64 X2 4200+ |
dual
core |
2200 MHz |
2x 512KB
|
89W |
|
47215 |
Athlon 64 X2 4000+ |
dual
core |
2000 MHz |
2x 1MB |
89W |
|
47214 |
Athlon 64 X2 3800+ |
dual
core |
2000 MHz |
2x 512KB
|
89W |
|
47213 |
Athlon 64 3800+ |
single
core |
2400 MHz |
512KB
|
62W |
|
47212 |
Athlon 64 3500+ |
single
core |
2200 MHz |
512KB
|
62W |
|
48068 |
Athlon 64 3200+ |
single
core |
2000 MHz |
512KB
|
62W |
|
50239 |
Athlon 64 3000+ |
single
core |
1800MHz |
512KB
|
62W |
|
47211 |
Sempron 64 3600+ |
single
core |
2000 MHz |
256KB |
62W |
|
47210 |
Sempron 64 3500+ |
single
core |
2000 MHz |
128KB |
62W |
|
47209 |
Sempron 64 3400+ |
single
core |
1800MHz |
256KB |
62W |
|
48067 |
Sempron 64 3200+ |
single
core |
1800MHz |
128KB |
62W |
|
47208 |
Sempron 64 3000+ |
single
core |
1600 MHz |
256KB |
62W |
|
47206 |
Sempron 64 2800+ |
single
core |
1600 MHz |
128KB |
62W |
|
|
AM2 Motherboard Chart |
|
ASI SKU |
Brand |
Model |
FF |
Chipset |
Main Features |
|
49311 |
Asus |
M2N-E |
ATX |
NVIDIA
nForce® 570 Ultra MCP |
8GB DDR2
800/667/533, AUDIO GBLAN PCIE SATA
RAID |
|
49310 |
Asus |
M2N-SLI Deluxe |
ATX |
NVIDIA
nForce® 570 SLI MCP |
4 x
240-pin DIMM Dual Channel DDR2
800/667/533, 2 x PCI-E x16 (x8 speed
in SLI mode), 7 x SATA 3.0Gb/s and1
external SATA 3.0Gb/s, Dual Gigabit
LAN |
|
49304 |
Asus |
M2NPV-VM |
MATX |
nVIDIA
GeForce 6150 + nForce 430
|
4 x
240-pin DIMM Dual Channel DDR2
800/667/533 ECC, 4 x SATA 3.0Gb/s
with RAID ready, Integrated Geforce
6 GPU, Dual output (DVI +VGA),
Gigabit LAN |
|
48855 |
Asus |
M2N32-SLI |
ATX |
NVIDIA
nForce® 590 SLI MCP |
6 x
Serial ATA 3.0Gb/s, NVIDIA
MediaShield RAID supports RAID 0, 1,
0+1, 5 and JBOD, |
|
50684 |
Asus |
M2N32-WS PRO |
ATX |
nVIDIA
C51XE and 55PXE |
4x DDR2
800/667/533, 2PCI-E x16 at full 16
in SLI mode |
|
51783 |
Asus |
M2N4-SLI |
ATX |
NVIDIA
nForce®4 SLI MCP |
4 x
DIMM, max. 8GB, DDR2-800/667/533, 2
x PCI Express x16 slot with NVIDIA®
SLI technology support, LAN NVIDIA
nForce®4 SLI MCP built-in Gigabit
MAC |
|
49915 |
Asus |
M2V AM2 |
ATX |
VIA
K8T890 and VIA VT8237A (Southbridge)
|
4 x
DIMM, max. 8GB, DDR2 800/ 667/ 533,
1 x PCI Express x16, 2 x Serial ATA
with RAID 0, RAID 1, JBOD. 1x
external SATA (SATA on the go) |
|
50272 |
Gigabyte |
M55SLI-S4 |
ATX |
nVIDIA®
nForce4 SLI |
Dual
Channel DDR2 800/667/533/400,
PCI-Express X16, Gigabit LAN, 6x
SATA 3Gb/s |
|
51470 |
Gigabyte |
M57SLI-S4 |
ATX |
NVIDIA®
nForce 570-SLI |
Dual
Channel DDR2 800/667/533/400,
PCI-Express X16, Gigabit LAN, 6x
SATA 3Gb/s |
|
51095 |
Gigabyte |
M59SLI-S5 |
ATX |
NVIDIA®
nForce 590-SLI |
Dual
Channel DDR2 800/667/533/400,
PCI-Express X16, Gigabit LAN, 6x
SATA 3Gb/s |
|
50448 |
Abit |
FATAL1TY AN9 32X |
ATX |
NVIDIA
nForce® 590 SLI MCP/SPP 190
|
8GB
DDR2 800/667/533, 2 x PCI-E X16, 6 x
SATA (RAID) 3Gb/s, Supports SATA
RAID 0/1/0+1/5 JBOD , IEEE1394a |
|
51203 |
Abit |
AN9 32X |
ATX |
NVIDIA®
nForce SPP 190/ 590 SLI |
4 X
240-pin DIMM sockets support max.
mem 8GB dual channel DDR2
800/667/533, 6 x SATA (RAID) 3Gb/s,
Supports SATA RAID 0/1/0+1/5 JBOB,
AudioMAX HD 7.1, NVIDIA® SLI Tech.,
Silent OTES 2, eSATA
|
|
|
|
|
|
|
|