Sept. 2006
Volume 5 / Issue 4

Downloadable Version (.pdf format)
 
 In This Edition:
 

Welcome to another edition of the ASI Technical Newsletter! This newsletter features articles on the latest computer technologies and products offered by ASI CORP, a leading North American Distributor of computer components and whitebox systems. We are focused on helping our resellers and system builders be able to offer the very best technology solutions and this newsletter is a free tool so you can learn about current and next generation products. If you are an ASI customer feel free to call our Technical Support Staff if you have any questions or visit www.asisupport.com (general technical help), www.asiserver.com (server solutions) or www.asimobile.com (notebooks) for further information. Thank you.



Overview
 

On July 27th, Intel announced the Intel® Core™2 Duo (C2D) and Intel® Core™2 Extreme (C2E) processors, which are the new brand names for Intel's next-generation of energy-efficient performance oriented desktop processors. Formerly known by the codename "Conroe,"  the Intel® Core™2 processors for desktop computers are based on the Intel® Core™ microarchitecture, Intel's new industry-leading foundation for all mobile, desktop and server platforms moving forward. These processors include two processing cores per chip, hence the “Duo” addition. These ground-breaking processors are built on Intel’s advanced 65-nanometer design and manufacturing process technology that shrinks a processor’s circuitry and transistors.

This combination will deliver higher-performing, yet more energy-efficient processors that will spur more capable, stylish, silent and smaller mobile and desktop PCs while saving on electricity usage. Intel is touting the C2D to deliver up to a 40% increase in performance while consuming 40% less electricity when compared to the Pentium D 960 processor. To quote Intel CEO Paul Otellini, "The Core™2 Duo processors are simply the best processors in the world. Not since Intel introduced the Pentium® processor has the industry seen the heart of the computer reinvented like this. This is not just an incremental change; this is a revolutionary leap." Otellini also said that with the debut of the C2D, Intel has definitely regained the performance crown from AMD, and early reviews of the Core™ 2 Duo have been simply stellar with performance gains as high as 70% over the AMD AM2 on CPU-bound benchmark tests. Otellini also predicted that the "Core 2 Duo is the growth engine for the next 500 million new internet users."
 
Brand New and Improved
 

Starting with these two new Intel® Core™2 Duo and Intel® Core™2 Extreme brands, the “2” designation signals the arrival of a new generation of technology to the Intel® Core™ processor line. The first "Core™" processor debuted in Q1 in the form of the Core™ Duo mobile processors, but the Core™ 2 line adds a bevy of new features to enhance performance and reduce power consumption. You will see these new mobile Core™ 2 Duo processors code-named "Merom" starting to trickle into ASI warehouses in the September timeframe. In order to be consistent with current Intel Core™ processor naming, Intel will continue to use such terms as “Duo” to effectively indicate the number of processing cores per product.

These two new brands will have new logos (can be seen below) which are consistent with the new Intel brand and corporate identity introduced earlier this year, yet visually distinctive in both design and coloring, to help easily identify these powerful state-of-the-art products as new and improved. These new dual-core processors for the desktop will include the industry’s largest integrated cache called Intel® Advanced Smart Cache (either 4MB or 2MB) that includes a unique design for faster performance on memory intensive applications. These products will also support such features as enhanced security, virtualization and manageability built right into the processors. These desktop Core 2 Duo processors will mark the arrival of Intel's cleanest dual-core design to date. Intel's existing 9XX and 8XX dual-core processors use two distinct cores, which communicate with each other over the front-side bus. In contrast, Conroe will have its two cores on the same silicon die (monolithic design), enabling faster inter-processor communication and a shared L2 cache to radically enhance performance.

 

Core™2 Duo processors E6000 Family (E6300 - E6700)

The basic Core
2 Duo family will consist of four processors: the E6300, E6400, E6600, and E6700. They will run at clock speeds of 1.86 GHz, 2.13 GHz, 2.40 GHz, and 2.66 GHz, respectively. The E6300 and E6400 will be equipped with a 2MB L2 cache; the other two models will have a 4MB L2 cache. Using Intel's 65 nm manufacturing technology, all come with a 1,066-MHz front-side bus, and will ack 291 million transistors onto a 143 square-millimeter slice of silicon.

ASI
SKU
Processor
Number
Clock
Speed
Cache
Size L2
Front
Side Bus
Dual
Core
Intel®
VT
EIST Intel®
EM64T
Execute
Disable Bit
sSpec# Package
50171 E6700 2.66 GHz 4MB 1066MHz SL9S7 LGA 775
50170 E6600 2.40 GHz 4MB 1066MHz SL9S8 LGA 775
50169 E6400 2.13 GHz 2MB 1066MHz SL9S9 LGA 775
50168 E6300 1.86 GHz 2MB 1066MHz SL9SA LGA 775

 
Core™ 2 Extreme Edition X6800

At the top of the line, the Core 2 Extreme processor is being aimed for gaming systems and graphics workstations. It's designated as the X6800 with a clock speed of 2.93 GHz, and gives you the ability to change the clock multiplier in able to push the performance envelope even further. This is the first Intel processor to officially have an un-locked clock multiplier where you can carefully overclock your system greater than the 11:1 stock clock multiplier ratio. Later in Q4 the next C2E will arrive as a quad-core desktop processor code-named "Kentsfield" and will surely keep Intel the performance leader on the desktop.

ASI
SKU
Processor
Number
Clock
Speed
Cache
Size L2
Front
Side Bus
Dual
Core
Intel®
VT
Enhanced
Intel
SpeedStep®
Technology
Intel®
EM64T
Execute
Disable Bit
sSpec# Package
50918 X6800 2.93 GHz 4MB 1066MHz SL9S5 LGA 775

 
Intel Core™ Microarchitecture:  Energy-Efficient Performance
 
Back at Spring IDF in early March, Intel announced their new Core micro-architecture, replacing the long-in-the-tooth Netburst® architecture design, which finally hit its thermal wall so to speak. Netburst® had a nice five year run but Intel could never get past 3.8GHz due to the resulting excessive heat, which couldn't be adequately dissipated by the cooling subsystem. Enter the Core micro-architecture, an evolutionary offshoot of the Pentium M mobile processor design, which puts a major emphasis on lowering power consumption along with Intel's older priority of boosting performance. Intel had to radically move away from its dependence on rising clock frequencies or "digital narcotics" as we've jokingly called it, to achieve their performance gains. In the past few years Intel added their "T's" or technologies to their processors, like Hyper-Threading, XD, EM64T, EIST,  & VT, to enhance performance without raising the clock frequency. The last trick they had left was to add a 2nd core to the mix to increase performance and lower the clock speed, but excessive thermals again proved to be the roadblock of the Netburst® architecture.

To confirm just how important it was for Intel to create such an energy-efficient new processor architecture I think these comments made by Intel Chief Technology Officer Justin Rattner at Spring IDF say it all. "Energy is on everyone's mind. It's the next frontier. Not only has it become a critical concern in our daily lives, it's become a critical concern in just about every platform we have. The amount of energy required to execute a single instruction has increased significantly, well over a factor of four over this time frame. (~13 years)." In 2001 Netburst® (Pentium 4) debuted and had about four times the performance of the original Pentium (1993), but it consumed about 3.5 times the energy per instruction. In 2003 Centrino Mobile Technology arrived with the Pentium M lineage of chips and changed this trend and Intel's way of thinking for all future chip generations. The Pentium M (Banias) consumed the same amount of energy per instruction as the original Pentium but has about 3 times the performance. The Core™ Duo, which came to market in Q1 of this year, has four times the performance and even lower per-instruction consumption than the Pentium M.

The Core™ micro-architecture utilizes a much shorter 14-stage processing pipeline where the workload is divided up in chunks. The Pentium 4 was designed with a very deep 31-stage pipeline. The Pentium M and Core Duo have a slightly shorter 12-stage pipeline. The Core™ micro-architecture is also "wider" with the ability to process four instructions per clock cycle versus prior Intel and AMD generations that can only crunch 3 instructions at the same time. The new Core™ 2 Duos can also process a single 128-bit SSE (Streaming SIMD [Single Instruction Multiple Data] Extension instruction every clock cycle where Pentium 4 and Athlon 64 take two clock cycles. Being able to process these SSE, SSE2 & SSE3 instructions faster substantially speeds up media encoding and transcoding applications. The Core™ micro-architecture also is able to combine processor micro-ops (decoded x86 instructions) and macro-ops (two combined x86 instructions) into one data item and sent through the pipeline in a single cycle, thus effectively issuing 5 instructions per clock cycle in a lot of instances.

Also the Core™ 2 Duos are designed in a "monolithic" fashion where both cores reside on the same die. Because of this design the two cores can access up to a 4MB pool of L2 Cache without having to go out across the very slow front-side bus. This L2 Cache can also be allocated on the fly depending on the task at hand, and if one core is busy it can utilize and access the entire 4MB pool of cache. The cache prefetching routines are also greatly improved, so cache misses are a rarity since the L2 caches are constantly providing the needed data without having to go out to main memory. Intel notes that these prefetching routines are so efficient that main memory latency and bandwidth issues are a thing of the past, and the front-side bus hardly ever gets saturated to impact performance.


Core
Microarchitecture - Main Features:
 

• 
Intel Wide Dynamic Execution  delivers more instructions per clock cycle as compared to the Netburst® micro-architecture with a 33% wider execution pipeline allowing each core to execute and complete up to 4 full instructions simultaneously in a single tick of a chip's clock. In addition, two features named micro-op fusion and macro-fusion automatically combines two high-level chip instructions, in some cases into a single instruction, so the Core™ 2 Duo's can effectively issue 5 instructions per clock cycle as compared to the Pentium 4/Pentium D and AMD Athlon 64 families which can only process 3 instructions per clock tick.

• Intel Advanced Smart Cache  includes a shared and multi-core optimized L2 cache that improves performance by dynamically allocating cache to each core depending on workload. Improves how high-speed cache memory is shared by multiple processor cores. For example, it lets one core control the whole cache when the other core is idle, and for other times, it governs how the same data can be shared by both cores.

• Intel Smart Memory Access is an improved set of algorithms that can predict what data should be "prefetched" from main memory into faster cache memory so it's at hand when the processor needs it. Improves performance by using advanced data pre-fetch algorithms that help hide system-memory latency effects. This is also known as memory disambiguation logic and it is great at correctly predicting the order of events and can execute the second instruction before the first one has completed.

• Intel Advanced Digital Media Boost means all "SSE" instructions can execute in a single clock tick. Prior processor families took two clock cycles to process this data. SSE stands for Streaming SIMD (single instruction, multiple data) Extensions and speeds several operations such as video decoding or digital photo processing. Effectively doubles the execution speed for many of the 128-bit SSE/2/3 instructions commonly used in multimedia and graphics applications.

• Intel Intelligent Power Capability allows the electrical shut down of portions of the chip that aren't needed at a particular time to support instruction execution. Optimizes power consumption by intelligently powering on processor-computing elements only when required.

Feature
Function
Benefit
Intel® Wide Dynamic Execution
Executes 4 instructions per clock cycle vs. 3 per clock with Intel Netburst®, Intel Pentium M andAMD micro-architectures
 
 Better performance on multiple application types and user environments on single and multithreaded apps:

        - Digital video-editing
        - Content creation
        - Entertainment / gaming

        - Productivity
        - Scientific calculations
Intel® Advanced Smart Cache
Increases efficiency of L2 cache to processor core data transfers
 
Entire L2 cache can be allocated to one core (vs. dedicated L2  for each core in Pentium D and AMD dual-cores)
 
Intel® Smart Memory Access
Efficiently feeds data into Intel's Wide Dynamic Execution engine
Maximizes main memory to processor bandwidth and reduces latency
Intel® Advanced Digital Media Boost
Allows 128-bit SSE/2/3 instructions to execute in a single clock cycle
 
Same instructions execute in 2 cycles on Intel Netburst® , Intel mobile and AMD micro-architectures
 Better performance on apps that use SSE instructions:
  •     Video, speech, gaming,  multimedia,
        photo processing
  •     Encryption, financial
  •     Engineering, scientific
     
Intel® Intelligent Power Capability
Conroe 65W desktop mainstream TDP, Woodcrest 80W server mainstream & 40W ultra dense TDP
Continued low power mobile platform w/ "Merom" in Q4
 Can help enable quieter, more power and
 efficient  system designs
 
Can help reduce overall power consumption


Better Acoustics
 
Intel Core™ 2 Duo processors are equipped with a new Digital Thermal Sensor (DTS) that enables efficient processor and platform thermal control. Thermal sensors located with the processor measure the maximum temperature on the die at any given time. Intel® Quiet System Technology, included in the Intel® 965 Express Chipset family, uses the DTS to regulate the system and processor fan speeds. The acoustic benefit of temperature monitoring is that system fans spin only as fast as needed to cool the system, and slower spinning fans generate less noise.
 
Platform Support
 
A platform based on the Intel® 965 Express Chipset family (P965, G965 & Q965) with an optimized DDR2-800 memory engine for improved system performance, is the ideal compliment for the Intel Core™ 2 Duo processor. New and enhanced technologies in the area of Intel integrated graphics found in the G965 chipset (X3000), improved HD 8-channel sound, 6 onboard SATA 3G ports with options for RAID 5, up to 10 USB 2.0 ports and extensive desktop manageability found in the Q965 chipset adds an array of capabilities to the new platform for the rest of 2006 and well into 2007. This new combination of processor and chipset brings an unparalleled level of performance to the desktop. These new Intel chipsets will be covered in another ASI technical document up on our ASI/Intel Technical Resource Center, and seen in the September '06 ASI Technical Newsletter.
 
Motherboards:
Because the Core™2 Duo and Core™2 Extreme processors use less power than the prior generations, like the Pentium 4/Pentium D processors, a motherboard's voltage regulator module (VRM) has to support the lower voltage of these new Core™ 2 Duo processors in this voltage range: 0.850V-1.3525V. Also, besides the Intel 965 chipset family based boards, motherboards using other Intel (975X, 946), and non-Intel chipsets (nVidia 590/570) for example are available with the correct voltage regulation down on the board to support the reduced core voltage of the Core™ 2 Duo processors. Older revisions of motherboards now being used in the field using the 975X chipset, such as Intel's D975XBX board, might not have the correct VRM circuitry to support the Core™ 2 Duos. Other MBs based on older chipsets like the 865G, 915 and 945 for example can still support the Conroe processors if the correct VRM circuitry is integrated onto the board. Because of this confusion over which MBs and which of their revisions support the C2Ds, we created a chart with all the MBs we currently resell that support the Core™ 2 Duos to make it easier for our sales reps and customers => Core 2 Duo MB Support Chart.
 
Chassis:
Intel thermal specifications require the use of a Thermally Advantaged Chassis (TAC) version 1.1 when integrating an Intel® Core™2 Duo Processor into your system. A "TAC" is designed to maintain an internal ambient chassis temperature below 38oC to help aid in keeping the processor's core temperature below its maximum Thermal Design Power (TDP), also referred to as Thermal Guideline. This is the maximum amount of heat which a thermal solution must be able to dissipate from the processor, so that the processor will operate under normal operating conditions. A TAC version 1.1 chassis is defined by the presence of an 80mm side-panel air duct, a 92mm rear chassis fan and side-panel venting holes above the graphics and add-in card slots to provide additional cooling for high-end PCI Express graphics and other peripherals. One great benefit of using the Core 2 Duos with their 65W power envelope is the ability to assemble much quieter and cooler systems in smaller form factors such as picoBTX and nanoBTX. These unique compact systems are showing up in numerous vertical markets and used as the main Media Center server or extender device throughout the digital home. Contrast these compact systems with ones built using Pentium 4 processors with their 115W TDP, Pentium D with 95W and the Pentium Processor Extreme with 130W, which all translates to larger, noisier, and less energy efficient systems.

     To view Intel's Thermally Advantaged Chassis list => Click Here
 
Power Supply:
Intel highly recommends an ATX12V version 2.2
power supply for use with both the Core™2 Duo (65W) and Core™2 Extreme (75W) processors. Please check www.intel.com/go/powersupplies for the appropriate support and validated power supplies. But please only use this chart as a guideline, since your particular system configuration will dictate the total wattage needed to run your system reliably. For a basic system using onboard graphics, Intel recommends a power supply in the 250-450W range and I would err towards the high-end unless you're using a very small footprint chassis. For a system with a discrete PCI Express x16 video card, Intel recommends a power supply in the 450-600W range, and if you employ two high-end 7950GX2s in SLI with multiple hard drives, you might even consider going with a 700W power supply.
 
Heatsink (Boxed Core™ 2 Duo Heatsink Fan Info)

The Intel® Core™2 Duo processors E6700, E6600, E6400, and E6300 ship with a FCLGA4-L fan-heatsink with an Intel part number of D60188-001. Some things to know about this fan-heatsink are the following:

This ATX thermal solution was designed for and should only be used with desktop Intel® Core™2 Duo processors rated at a Thermal Design Profile of 65W.

  • It is not backward compatible with any Pentium® 4 or Pentium® D processor fan-heatsinks and should not be used on Pentium® 4 or Pentium® D processors.
     
  • You should also not use the older Pentium® 4 or Pentium® D boxed processor fan-heatsinks on desktop Intel® Core™ 2 Duo processors.

This fan-heatsink is RoHS compliant.

This fan-heatsink utilizes a new TC-1996 Thermal Interface Material (TIM). Intel will be offering the TIM replacement in a syringe for the Intel® Core™2 Duo and Intel® Core™2 Extreme processors. Be sure to clean the fan-heatsink and processor integrated heat spreader of any debris or previous applied material prior to reapplication of the TIM.

  • You may order TIM replacement kits through Intel Customer Support. The Intel part number is D54816-001. For contact information for your region, click here.

 

       

 New Intel Desktop Chipsets

The P965, G965, and Q963 Express Chipsets

Earlier this year, at Computex, Intel introduced it's first Broadwater chipset the P965 Express. Designed with the Core 2 Duo processor in mind, the P965 chipset introduced some new technologies that are slowly making their way across most of Intel's incoming chipsets. These technologies are:

Fast Memory Access (FMA): This new technology significantly optimizes the available memory bandwidth usage and reduces memory access latency.

  • Maximizes memory bandwidth utilization
  • Reduces memory latency
  • Improves system performance

Quiet System Technology (QST): Utilizes the Digital Thermal Sensor (DTS) embedded inside of the Core 2 Duo processors to regulate the system and processor fan speeds. This completely controls the fan speed in order to insure that they only spin as fast as necessary to keep the system running at it's optimum performance temperatures and so that you get the quietest computing experience possible.

Flex Memory Technology (FMT): Allows users more flexible upgrade options for their memory by allowing them to upgrade their PC using different sized memory modules while still retaining the ability to run in dual channel mode for speed enhancement.

USB Port Disable: Previously only available as a registry hack, this new added technology allows individual USB ports to be enabled or disabled as needed. This provides added security by preventing data transfer through the USB ports to or from external devices.

Clear Video Technology (available only on the G965 and Q963 Express Chipsets): Designed with the home user in mind, this technology enhances video playback through advanced digital processing.

  • Enhanced high-definition video playback
  • Sharper images
  • Precise color control
  • Advanced display capability
Chipset
Target Segment Performance PC,
Mainstream PC
Mainstream PC Mainstream PC
Socket Socket T (LGA775) Socket T (LGA775) Socket T (LGA775)
CPUs
Supported
Core 2 Duo processor w/ VT,
Pentium D processor 900 Series
Pentium 4 processor w/ HT Technology
Core 2 Duo processor w/ VT,
Pentium D processor 900 Series
Pentium 4 processor w/ HT Technology
Core 2 Duo processor w/ VT,
Pentium D processor 900 Series
Pentium 4 processor w/ HT Technology
Hyper-Threading
Support
Yes Yes Yes
FSB
Support
(MHz.)
1066 / 800 / 533 1066 / 800 / 533 1066 / 800 / 533
Memory
Type
Dual Channel DDR2
800/667/533 (up to 12.8GB/s)
Dual Channel DDR2
667/533
Dual Channel DDR2
667/533
Max
Memory
8GB 8GB 8GB
Integrated
Video
N/A Intel
GMA X3000
w/ Intel Clear
Video Technology
Intel
GMA X3000
w/ Intel Clear
Video Technology
External
Video
PCI-Express
X16 Graphics port
PCI-Express
X16 Graphics port
DID, ADD2, DVI
PCI-E
X1
6 6 6
SATA 6 (3G)
Optional Intel
Matrix Storage
Technology
6 (3G)
Optional Intel
Matrix Storage
Technology
6 (3G)
Optional Intel
Matrix Storage
Technology
USB 8 USB 2.0 Ports;
Dual EHCI: USB disable
10 USB 2.0 Ports;
Dual EHCI: USB disable
10 USB 2.0 Ports;
Dual EHCI: USB disable
Networking Optional Intel
GbE LAN
Intel Integrated
10/100/1000
Intel Integrated
10/100/1000
Audio Intel High
Definition Audio
Intel High
Definition Audio
Intel High
Definition Audio
Viiv Support Yes* Yes* Yes*
Other
Features
Intel Quiet
System Technology,
Intel Fast
Memory Access,
Intel Flex
Memory Technology,
USB Port Disable
Intel Quiet
System Technology,
Intel Fast
Memory Access,
Intel Quiet
System Technology,
Intel Fast
Memory Access,
Intel Stable
Image Platform,
Intel Flex
Memory Technology,
USB Port Disable
RoHS
Compliant
Yes Yes Yes

*While combined with a Viiv capable SouthBridge chip

Motherboards featuring these chipsets are being released by ASUS, Gigabyte, Intel (of course), and Foxconn. ASI has begun stocking these boards in multiple locations to insure speedy delivery to it's customers.

  P965 Chipset G965 Chipset Q963 Chipset
  • P5B (SKU 51062)
  • P5B Deluxe
  • P5B Deluxe / WiFi-AP (SKU 51061)
  • P5B-VM

N/A

  • GA-965P-S3 (SKU 51773)
  • GA-965P-DS3 (SKU 51131)
  • GA-965P-DS4
  • GA-965-DQ6 (SKU 51128)

N/A

N/A

  • DP965LT
  • DG965WHMKR (SKU 50733)
  • DG965RYCK (SKU 50739)
  • DG965MSCK (SKU 50741)
  • DG965SSCK (SKU 50737)
  • DG965OT (SKU 50735)
  • DG965MQMKR (SKU 50731)
  • DQ963FXCK (SKU 50743)
  • P9657AA-8KS2H
  • P9657AA-8EKRS2H

N/A

N/A

 
 
 

 

Nvidia GeForce 7950GX2

The Power of SLI in One Video Card

o'ver-kill'  vt.  destroy with more force than required; n.

NVIDIA® seems to have borrowed the dictionary definition of this term while creating it's newest product, the NVIDIA® GeForce® 7950 GX2 dual GPU graphics card. NVIDIA has essentially created a card with so much power that the vast majority of the games on the market can not even take full advantage of it in single card SLI mode. When you consider the graphics power available with dual cards in Quad-SLI mode, NVIDIA has raised the bar on high-end graphics to an almost unobtainable level for it's competition.

While many enthusiasts enjoy high-end gaming systems, many of them also lack dual VGA slot SLI capable motherboards. NVIDIA is here to save the day once more with SLI graphics in a single card. Instead of installing dual graphics cards in your system you can now install 1 PCI Express card which essentially has 2 GeForce 7900 GT cards bolted together. Instead of the standard 450MHz. core clock of the 7900 GT cards and the 7900 GX2 SLI cards before it, (which were available to specific system builders only), each of the the 7950 GX2 cores run at 500MHz clock speed. With 1.2GHz. of effective RAM speed, and 1GB total memory on the 7950 GX2, nothing else in it's class even comes close.

The new card was designed with the DIY market in mind and suffers from very few (if any) of the issues of the 7900 GX2. The price of the prior generation dual GPU card was prohibitively expensive, much of the time fetching more than $1k due to it's lack of availability except in the Tier 1 OEM market, the new 7950 GX2 can generally be found for less than $600 and is readily available in stores and on-line.

The days of having to spend four to five thousand dollars on a custom-built system from a recognized builder in order to get a quad-SLI setup are over. Also over are the days of needing specialized motherboards with the NVIDIA nForce4 SLI chipset. NVIDIA has removed this requirement with the 7950 GX2 and now pretty much any motherboard with a PCI-E X16 slot that can communicate with the 7950 GX2's PCI-E switch should be able to handle this card with little more than a BIOS upgrade and making sure that you're running at least version 91.45 of NVIDIA's ForceWare Drivers (Driver Link Here).

Primary changes between the 7900 GX2 and the 7950 GX2 (besides price and availability), include the physical design of the card. The original 7900 GX2 which was on display at CES was a beast. Over 12" long and requiring dual PCI-E power cables to run it (one to each PCB), the 7950 is a more standard 9" in length leaving much more room inside your case for other necessities like hard drives and power to this card is handled via a single PCI-E video card power connector.

The cooling solution has changed on the 7950 GX2 as well. The 7900 GX2 had a rather bulky and noisy fan solution which rivaled a dust-buster when the gaming action got hot and heavy. The new solution on the 7950 GX2 is a much quieter and thinner dual fan / heat sink solution which keeps both GPUs relatively cool at all times while remaining quieter than many single GPU cards available on the market today. NVIDIA has also removed one of the SLI links which was on the 7900 GX2 cards. It's unclear how they went from requiring 2 SLI connectors to run in Quad-SLI mode down to 1 connector, but NVIDIA assures us that no performance was sacrificed and no animals were harmed in the process. 

In addition to everything else, NVIDIA continues to push into the home entertainment market by requiring that all of their board partners on the 7950 GX2 make their card HDCP compliant by adding the crypto-ROM chip which is required to protect high-definition content. Not that we think that many 7950's are going to find their way into Media Center machines, but this is a good precedent to set, and hopefully all of their cards going forward will have this feature as well. The future is high-def everything, NVIDIA would do well to make sure that everything it produces complies and allows it's customers to progress with the times.

A technical specification comparison of recent cards from both NVIDIA and ATI is below as well as ASI product SKUs for the 7950 GX2. While the numbers are impressive by themselves, seeing the card in action is much more so.

Technical Specifications and Performance

  GeForce 7950 GX2 GeForce 7900 GTX GeForce 7900 GT Radeon X1950XTX Radeon X1900XTX
Graphics Bus Technology PCI Express PCI Express PCI Express PCI Express PCI Express
Memory 1GB (512MB per GPU) 512MB 256MB 512MB 512MB
Memory Interface 512-bit (256-bit x2) 256-bit 256-bit 256-bit 256-bit
Memory Bandwidth (GB/sec) 76.8 51.2 42.2 64 49.6
Fill Rate (Billion pixels/sec) 24 15.6 10.8 12 10.4
Vertices/second 2 Billion 1400 Million 940 Million 1.25 Billion 1.3 Billion
Pixels per clock (peak) 48 24 24 48 48
RAMDACs (MHz) 500 650 450 650 650

 ASI Product SKU Numbers
ASI SKU Manufacturer Card Product Page
49641 ASUS EN7950GX2/2PHT/1G Click Here
49337 BFG GeForce 7950 GX2 (BFGR7950GX21GBE) Click Here
49597 eVGA e-GeForce 7950 GX2 (01G-P2-N592-AX) Click Here
49528 Gigabyte GV-3D1-7950-RH Click Here
49472 MSI NX7950GX2-T2D1GE (MS-V801-065) Click Here
49594 XFX GeForce 7950 GX2 M570 1GB DDR3 XXX (PVT71UZDD9-7950GX2) (570MHz) Click Here
49595 XFX GeForce 7950 GX2 M520 1GB DDR3 Extreme Edition (PVT71UZDF9-7950GX2) (520MHz) Click Here

As awesome as this card is, there are still a few issues which are in the process of being worked out, most of them not within NVIDIA's control. Microsoft's DX9 is not fully prepared to handle the capabilities of the 7950 GX2 card (especially while running in a Quad-SLI configuration. The way DX9 limits the number of back buffers that can be queued, along with it's inability to correctly push 4x AFR somewhat limits your experience, but Microsoft has been busy assuring NVIDIA that the problems have been corrected in the impending release of DX10 (Direct X X?).

In the end, if you're a serious gamer looking for a serious card, this is the one (or ones) that you want. NVIDIA has brought to the table a card which is currently unbeatable and in addition is expandable with a second unit to make its domination unquestionable.


 
AMD Socket AM2 Processor Review
Revised Desktop Lineup Provides New Options for System Builders
Recently hitting the market, the AMD Socket AM2 processors are the next generation of cost effective, high performance CPU from Intel's #1 competitor.

The Socket AM2 (originally called M2) processors are not based upon an entirely new architecture but rather features an updated core (REV F2) of the Athlon 64, Athlon 64 X2 (dual core), Sempron 64, and FX processor lines with certain improvements and a few new models thrown into the mix. This is probably the last major update before their entirely new core architecture is released next year.

The first and most obvious change is the socket. The AM2 socket has 940 pins but is not backwards or forwards compatible with Socket 940 Opteron processors. You must purchase the new line of AM2 socket motherboards available from all major brands (see chart below). The heatsink retention mechanism has been updated meaning some third-party K8 AMD heatsinks will not be compatible but "Lighter weight (and AMD retail heatsinks) that clip onto the socket 754/939/940 heatsink retention frame center tabs will continue to be compatible with the socket AM2 heatsink retention frame" - source (Frosty Tech article).

The biggest innovation is the fact that AMD replaced the integrated DDR1 memory controllers with DDR2 memory controllers, opening up memory bandwidth. Single core will be able to handle up to 667MHz DDR2, while the AMD Athlon FX-62 version  (ASI SKU# 47221) will be able to support up to 800MHz DDR2 modules.

Another key advancement is that Socket AM2 solutions provide lower heat dissipation and power consumption than their Socket 939 counterparts while still using a 90nm SOI (silicon on insulator) process technology. As an example the single core Athlon 64 3800+ reduces maximum heat dissipation from 89W to 62W - a 30% decrease. Simply put this equals more performance per watt. With less heat Revision F2 processors also mean potentially quieter systems with  longer life and lowered energy costs.

 

 

Revision F2 core up close using x-ray vision! This is an Athlon 64 X2.

What about chipsets and motherboards? Nvidia chipsets leads the way with a few offerings from VIA technologies. We will take closer look at those below after checking out the processor lineup.
AM2 Processor Comparison Chart
ASI SKU Model Cores Core Speed L2 Cache Thermal Power
47221 Athlon 64 FX-62 dual core 2800 MHz 2x 1MB 125W
47220 Athlon 64 X2 5000+ dual core 2600 MHz 2x 512KB 89W
47219 Athlon 64 X2 4800+ dual core 2400 MHz 2x 1MB 89W
47218 Athlon 64 X2 4600+ dual core 2400 MHz 2x 512KB 89W
47217 Athlon 64 X2 4400+ dual core 2200 MHz 2x 1MB 89W
47216 Athlon 64 X2 4200+ dual core 2200 MHz 2x 512KB 89W
47215 Athlon 64 X2 4000+ dual core 2000 MHz 2x 1MB 89W
47214 Athlon 64 X2 3800+ dual core 2000 MHz 2x 512KB 89W
47213 Athlon 64 3800+ single core 2400 MHz 512KB 62W
47212 Athlon 64 3500+ single core 2200 MHz 512KB 62W
48068 Athlon 64 3200+ single core 2000 MHz 512KB 62W
50239 Athlon 64 3000+ single core 1800MHz 512KB 62W
47211 Sempron 64 3600+ single core 2000 MHz 256KB 62W
47210 Sempron 64 3500+ single core 2000 MHz 128KB 62W
47209 Sempron 64 3400+ single core 1800MHz 256KB 62W
48067 Sempron 64 3200+ single core 1800MHz 128KB 62W

47208

Sempron 64 3000+ single core 1600 MHz 256KB 62W

47206

Sempron 64 2800+ single core 1600 MHz 128KB 62W
AM2 Motherboard Chart

ASI SKU

Brand Model FF Chipset Main Features
49311 Asus M2N-E ATX NVIDIA nForce® 570 Ultra MCP 8GB DDR2 800/667/533,  AUDIO GBLAN PCIE SATA RAID
49310 Asus M2N-SLI Deluxe ATX NVIDIA nForce® 570 SLI MCP   4 x 240-pin DIMM Dual Channel DDR2 800/667/533, 2 x PCI-E x16 (x8 speed in SLI mode), 7 x SATA 3.0Gb/s and1 external SATA 3.0Gb/s,  Dual Gigabit LAN
49304 Asus M2NPV-VM MATX  nVIDIA GeForce 6150 + nForce 430 4 x 240-pin DIMM Dual Channel DDR2 800/667/533 ECC, 4 x SATA 3.0Gb/s with RAID ready, Integrated Geforce 6 GPU, Dual output (DVI +VGA),  Gigabit LAN
48855 Asus M2N32-SLI ATX  NVIDIA nForce® 590 SLI MCP 6 x Serial ATA 3.0Gb/s, NVIDIA MediaShield RAID supports RAID 0, 1, 0+1, 5 and JBOD,
50684 Asus M2N32-WS PRO ATX nVIDIA C51XE and 55PXE 4x DDR2 800/667/533, 2PCI-E x16 at full 16 in SLI mode
51783 Asus M2N4-SLI ATX NVIDIA nForce®4 SLI MCP   4 x DIMM, max. 8GB, DDR2-800/667/533, 2 x PCI Express x16 slot with NVIDIA® SLI technology support, LAN NVIDIA nForce®4 SLI MCP built-in Gigabit MAC
49915 Asus M2V AM2 ATX VIA K8T890 and VIA VT8237A (Southbridge)  4 x DIMM, max. 8GB, DDR2 800/ 667/ 533,  1 x PCI Express x16, 2 x Serial ATA with RAID 0, RAID 1, JBOD. 1x external SATA (SATA on the go)
50272 Gigabyte M55SLI-S4 ATX nVIDIA® nForce4 SLI Dual Channel DDR2 800/667/533/400, PCI-Express X16, Gigabit LAN, 6x SATA 3Gb/s
51470 Gigabyte M57SLI-S4 ATX NVIDIA® nForce 570-SLI Dual Channel DDR2 800/667/533/400, PCI-Express X16, Gigabit LAN, 6x SATA 3Gb/s
51095 Gigabyte M59SLI-S5 ATX NVIDIA® nForce 590-SLI Dual Channel DDR2 800/667/533/400, PCI-Express X16, Gigabit LAN, 6x SATA 3Gb/s
50448 Abit FATAL1TY AN9 32X ATX NVIDIA nForce® 590 SLI MCP/SPP 190 8GB  DDR2 800/667/533, 2 x PCI-E X16, 6 x SATA (RAID) 3Gb/s, Supports SATA RAID 0/1/0+1/5 JBOD , IEEE1394a
51203 Abit AN9 32X ATX NVIDIA® nForce SPP 190/ 590 SLI 4 X 240-pin DIMM sockets support max. mem 8GB dual channel DDR2 800/667/533,  6 x SATA (RAID) 3Gb/s, Supports SATA RAID 0/1/0+1/5 JBOB, AudioMAX HD 7.1, NVIDIA® SLI Tech., Silent OTES 2, eSATA

Original Websource: www.asisupport.com (Tech Support) / www.asipartner.com (Corporate website)