February 2005

Downloadable Version (.pdf format)

Volume 4, Issue 1   

In This Edition:
Welcome to another edition of the ASI CORP Technical Newsletter! This newsletter features articles on new and current computer technologies and products sold by ASI and our vendors. If you are an ASI customer feel free to call Technical Support Staff if you have any questions. Please visit www.asisupport.com (general technical help), www.asiserver.com (server solutions), or www.asimobile.com (notebook support and configuration) for further information. Thank you.

Intel® Next-Generation Centrino™ Mobile Technology 
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     Intel has officially announced the Next Generation Centrino™ mobile technology on January 19, 2005.  The Next Generation Centrino™ mobile expands on the technologies of the first generation key components such as i855 chipset family, Pentium M mobile processor, and PRO/Wireless network.  In addition, the Next Generation Centrino™ mobile enhance the three key components to deliver greater performance, multiple wireless LAN capability, greater battery life, and thinner/lighter designs. Inside the Next Generation Centrino™ mobile consists Intel® Pentium® M processor with up to 533 MHz FSB, Mobile Intel® 915 Express chipset family, and Intel® PRO/Wireless Network Connection family.


The 1st notebooks utilizing the Next Generation Centrino™ mobile technology are now available through ASI. The Z71A Whitebox notebook (ASI SKU# 34809) is now in stock and ready to be custom built for you!

The Intel® Pentium® M Processor is the first component solution for Intel Centrino™ mobile technology.  Based on the first generation Pentium M processor architecture aka "Dothan", the new Pentium M processor offer 533-MHz front side bus (FSB) high performance and many new enhancements.  With an increase of 400FSB to 533FSB, this gave the new Pentium M processor a 33% increase in performance at same clock level.

Furthermore, it reduces latencies between high speed PC2700 (333MHz) memory given the processor and memory synchronous operation at 133MHz. The outcome of this is faster execution of instructions for daily active applications, hardcore games, graphic rendering, & multimedia encoding/decoding.

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Key features of the new Pentium M processor
Features Benefits
Power Optimized 533/400 MHz processor system bus, Micro-ops Fusion & Dedicated Stack Manager Allows faster execution of instructions at lower power.
Support for enhanced Intel SpeedStep® technology w/ multiple voltage & frequency operating points. Allows for better match of performance to application demand. which enables real-time dynamic switching between multiple voltage and frequency points. This results in optimal performance without compromising low power. The processor features the Auto Halt, Stop Grant, Deep Sleep, and Deeper Sleep low power states.
Execute Disable Bit (XD) Support Can help prevent certain classes of malicious “buffer overflow” attacks when combined with supporting operating system. This is an optional feature and is available on the latest Intel® Pentium® M Processors.
Support for Intel® Mobile Voltage Positioning (Intel® MVP IV) Dynamically lowers voltage based on processor activity to lower thermal design power enabling smaller notebooks.
Micro FCPGA & FCBGA packaging technology Optimized for a range of thinner, lighter designs including <1” thick that deliver outstanding performance.
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Intel Mobile Processor with embedded Execute Disable Bit (XD)
  ASI SKU Processor Number Processor Generation (Architecture) Clock Speed Front Side Bus Cache XD
Intel® Pentium® M Processor

35159

770

Dothan 90nm 2.13 GHz 533 MHz 2MB L2 Yes
35158

760

Dothan 90nm 2.00 GHz 533 MHz 2MB L2 Yes
35157

750

Dothan 90nm 1.86 GHz 533 MHz 2MB L2 Yes
35156

740

Dothan 90nm 1.73 GHz 533 MHz 2MB L2 Yes
35155

730

Dothan 90nm 1.60 GHz 533 MHz 2MB L2 Yes
  • Click here for Intel Pentium® M Processor overview
  • Click here for Intel Pentium® M Processor Spec Finder

Mobile Intel 915 Express Chipset (aka Alviso) family platform is the second component solution for Intel Centrino™ mobile technology.  The Mobile Intel 915 Express Chipset is packed with the latest technology found on desktop main board Intel 915 Chipset Family such as Intel Graphics Media Accelerator 900, PCI Express x16, PCI Express x1, DDR2-400/533 Dual/Single Channel, Serial ATA 150, and High Definition Audio.  Notebook with these technology, performance is flawlessly. There are four flavor to Mobile Intel 915 Express Chipset. They have their different features, different use, and different price depends on system manufacturers targets. 
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Mobile Intel® 915/910 Express Chipset Comparison:
  Chipset Family Special Features (features mark in blue distinguish then from its sibling)

Mainstream

Mobile Intel® 915PM Express Chipset Supports 533/400FSB Processors, PCI Express x16 based graphics, PCI Express x1(ExpressCard), DDR2-400/533 Dual/Single Channel memory, Serial ATA, ATA100, USB2.0, Ethernet LAN, Wi-Fi LAN, and Intel® High Definition Audio.

Performance

Mobile Intel® 915GM Express Chipset Supports 533/400FSB Processors, Intel® Graphics Media Accelerator 900, PCI Express x1(ExpressCard), DDR2-400/533 Dual/Single Channel memory, Serial ATA, ATA100, USB2.0, Ethernet LAN, Wi-Fi LAN, and Intel® High Definition Audio.
  • Click here for Mobile Intel 915 Express Chipset Matrix Chart

The Intel® PRO/Wireless Network Connection is the integrated Wireless LAN (WLAN), which is the third component solution for Intel Centrino™ mobile technology. The new PRO/Wireless (2915ABG) is a single, a dual band, and a tri-mode solutions. 

It supports Wi-Fi standard single band (802.11b), dual band (802.11a/b), dual mode (802.11b/g), and tri-mode (802.11a/b/g). With the multi-mode technology, it provides freedom and flexibility to work and play on the go.  It connects through wireless LAN networks at home, office, hotels, airports, or any location with Wi-Fi Alliance standard signal.  

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Intel® PRO/Wireless 2915ABG (WM3B2915ABG) Network Connection (Tri-mode 802.11a/b/g) ASI SKU # 31096
Features  Benefits
Wi-Fi CERTIFIED Wi-Fi CERTIFIED for 2.4 GHz and 5 GHz band, WMM CERTIFIED, WPA and WPA2
WLAN Standard  IEEE 802.11a, IEEE 802.11b, IEEE 802.11g, 802.11d, 802.11h, 802.11i, and 802.11e
Operating Frequency
  • 5 GHz UNII: Orthogonal Frequency Division Multiplexing (OFDM) for 802.11a
  • 5 GHz UNII: Orthogonal Frequency Division Multiplexing (OFDM) for 802.11a
  • 2.4 GHz ISM: Direct Sequence Spread Spectrum (DSSS) for 802.11b
Performance Typical indoor range of 40 ft (12 m) @ 54 Mbps / 300 ft (91 m) @ 6 Mbps for 802.11a, 100 ft (30 m) @ 11 Mbps / 300 ft (90 m) @ 1 Mbps for 802.11b, 100 ft (30 m) @ 54 Mbps / 300 ft (91 m) @ 1 Mbps for 802.11g

Intel® Wireless Coexistence System support enables reduced interference between Intel PRO/Wireless & certain Bluetooth devices.For systems designed with two antennas, real-time antenna selection enables optimized WLAN performance. Real-time temperature calibration dynamically optimizes wireless performance by adjusting output power to temperature changes for increased throughput & range with 802.11a radio.
Security
 I.  Authentication 
II.  Encryption
S
 I.  LEAP, WPA, 802.1X, EAP-TLS, EAP-FAST, PEAP
II.  CKIP, TKIP, 128-bit and 64-bit WEP, Hardware AES
Intel® PROSet Software
  • Easy-to-use interface with Intel® Smart Wireless Solutions support
  • IT Configuration Utility
  • Single Sign On support
  • Centralized Profile Management
  • EAP-SIM support
  • Supports Cisco, Check Point Software Technologies, Microsoft and Intel VPN connections.
  • Support Microsoft Windows XP (Professional, Home, Tablet) & Windows 2000
Power Management Intel® Intelligent Scanning Technology reduces power by controlling the frequency of scanning for access points. A user selectable feature with five different Power states, which allows the user to make their own power vs. performance choices when in battery mode.
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  • Click here for Intel PRO/Wireless 2915ABG Overview (PDF file)

Networked Attached Storage & ReadyNAS 600
Growing Storage Needs Require New Solutions
For many small to medium businesses their server and network storage needs can quickly outgrow the capacity of their server systems. It can be difficult and expensive to increase the capacity of working servers and companies risk costly downtime during such upgrades. One clear solution is the use of NAS devices.

NAS stands for Network Attached Storage meaning dedicated storage devices connected to your LAN instead of directly connected to a system or server. Such devices can take several forms but a true NAS device is designed only for storage not for running applications, therefore saving the costs of expensive motherboards, processors and software required to make a full file server.

A NAS device can just be attached to the network via standard Ethernet cables and quickly configured to serve your storage or backup needs.  It does not require costly server upgrade or downtime and usually offers more universal compatibly with different types of operating systems.

Click here for a diagram of typical NAS device layout

Hot New Product! ReadyNAS 600
Until now most NAS devices were expensive and required technical expertise to setup. No longer is this true!

ASI is now offering a flexible, cost-effective, and easy to use NAS product from a company called Infrant Technology (www.infrant.com).  This product is called ReadyNAS 600.  It is the world's smallest RAID 5 NAS device and uses SATA drives for maximum capacity and uses a powerful 32-bit RISC Network Storage Processor.

The ReadyNAS 600 series is easy to use because of Infrant's embedded OS called "RAIDiator." RAIDiator™ is Infrant's own embedded operating system that exploits the features of the Infrant ReadyNAS™ Network Storage System board. 

With the built-in FrontView™ Setup Wizard, whether an ReadyNAS box is being used by an advanced IT wizard or a novice home user, setting up the NAS is a breeze. It can be used for backup, file sharing and storage, digital media storage, and much more.

Other key features built into the ReadyNAS 600 products is the ability to add a hot-spare hard drive for improved data protection, background RAID synchronization to get started fast, ability to set disk quotas, built in print server (connect two printers to USB ports), compatible with many operating systems, Gigabit Ethernet interface, ability to take snapshots of data that can be later restored, three different security modes, online updates, and much more.

There are two product SKU # detailed in the table below:

ASI SKU Model Max Drives Max Capacity Interfaces RAID Levels Special Features
 34426 ReadyNAS RN606 4 SATA drives 640 Gigabytes Gigabit Ethernet (RJ45), Two USB 2.0 ports Hardware RAID 0, 1, and 5 DHCP and static IP support, compatible with Windows, MAC, Unix and Linux systems, built-in print server
 34431 ReadyNAS RN610 4 SATA drives 1 Terabyte Gigabit Ethernet (RJ45), Two USB 2.0 ports Hardware RAID 0, 1, and 5 DHCP and static IP support, compatible with Windows, MAC, Unix and Linux systems, built-in print server
Here is a screenshot of the RAIDiator setup wizard:

Recommended SATA Hard Drives for RAID
ASI SKU  Brand Model Type Capacity Speed Specs Interface
29718 Western Digital WD2500SD Western Digital Caviar RAID Edition 250GB 7200rpm 8MB SATA 150
20304 Western Digital WD360GD  Raptor drives 36GB 10,000RPM 8MB SATA 150 
22139
25229 Western Digital WD740GD  Raptor drives 74GB 10,000RPM 8MB SATA 150
26929

 Introduction to Balanced Technology Extended (BTX)
 A new PC Form Factor emerges
  Starting in late Q4, 2004, distributors began receiving and selling products based on the BTX form factor. Since this is an entirely new product, we are going to present you with a brief overview which will allow you to better understand the technology behind BTX technology and all that it encompasses.

In the beginning...

  At the Intel Developers Forum in the Fall of 2003 Intel announced the specifications for the new scalable form factor, BTX. The BTX (Balanced Technology Extended) form factor was designed to provide better routing, thermals and structural support for upcoming new technologies. The new board layout and design allows the use of low profile case designs with better performing CPU's. The current ATX technology was introduced back in 1995, I think you'd agree that a lot has changed since then. ATX has been struggling to keep up with the power and thermal demands that have been placed on it since the advent of the P4 and the time has finally come to stand aside and let it's successor take it's place.

Why the need for a change?

  While ATX had many improvements over it's previous technologies, it has reached the limit of what can be done to modify it's design in order to make new technology work. ATX form factor designs were never meant to scale to fit smaller applications, therefore any smaller system boards that were needed were difficult to lay out and costly to design. The BTX form factor was designed with scalability in mind. From the beginning it has been planned with 3 standard board sizes and 2 thermal module designs (type I and type II). Type I (Standard Height) Thermal Modules are designed to support system sizes ranging from full towers down to small form-factor (SFF) machines. Type II (Low Profile) Thermal Modules are designed to support ultra-thin, ultra-small form-factor systems.

BTX Board Sizes
microBTX BTX picoBTX
 
  • 10.4" x 10.5" (264.16mm)
  • Up to 4 Expansion Slots
  • Est. Arrival Q4, 2004
  • Thermal Module Type I
 
  • 12.8" x 10.5" (325.12mm)
  • Up to 7 Expansion Slots
  • Est. Arrival Q2, 2005
  • Thermal Module Type I
 
  • 8.0" x 10.5" (203.20mm)
  • Up to 2 Expansion Slots
  • Est. Arrival Q3, 2005
  • Thermal Module Type II

  In addition to the scalability of the BTX form factor, many other issues have been addressed as well. With the increased power requirements of modern processors there have been several items that have needed to be changed. Increased power means increased heat. While looking at all of the options you now have available to cool modern systems, some of them have become ridiculously expensive. Besides the standard heatsink route, people have now began water cooling systems or even going as far as using peltier cooling, or even in some cases cryo cooling (recirculatory refrigeration). Granted, those last few methods are mainly for the die hard system cooling crowd, but even the most modest of power users has now taken to, at the very least, filling his case with extra fans to protect his computing investment. All of this cooling comes at a price... and I'm not just talking about financial. I've personally been guilty of adding so many fans to my case that it makes it practically impossible to sleep in the house at night due to all of the noise. BTX addresses both of these issues.

The sound of silence

  Ok, well maybe it's not silence, but it's much closer than we have been in several years. One of the advantages of BTX design is the effect that it has on the thermals of the system allowing the air to flow better through the case due to the placement of the slots and the positioning of the cabling. The design of the board routes the airflow in the case from across the front of the board where the CPU is positioned,  then across the chipset and past the 16x PCI express slot then out the back of the case. Looking at the pictures below of the fan bottoms, you can see that the new Thermal solution has been designed to also provide a nice airflow under the motherboard to add additional cooling. Acoustically the new design is better because it only requires two fans, the thermal module fan and the power supply fan.

BTX Thermal Fans

Low Profile thermal Fan Type I mainstream Thermal Fan top Type I Performance thermal Fan top
Type I Standard thermal Fan Type I mainstream Thermal Fan bottom Type I Performance thermal Fan bottom

Better routing through new technology

As was mentioned earlier, one of the problems with the ATX form factor design is that it does not easily lend itself to be modified for use in different (usually smaller) devices. The routing and component placement in ATX has become increasingly complex through the years as the need for different components have been added to the board. The area around the core had become saturated and there were definitely issues in the MCH-to-memory routing path.

The BTX design has a clean ICH-to-I/O routing path, and has also increased the rear Panel I/O capacity and improved MCH-to-memory routing length. A fresh board design has allowed components to be placed in the most logical positions when considering power requirements, partner components, and thermal requirements instead of trying to stuff them in wherever they would fit on a crowded motherboard. There has also been a slight increase in board area when comparing microBTX to microATX or in comparing BTX to ATX. The core components are stable as you scale the board from picoBTX to microBTX, and onto BTX.

How about some products?

Below is a picture of Intel's D915GMH (Digital Office) motherboard, they will have a Digital home version also. You can see that the layout of the board is designed to provide much better airflow. The memory has been moved to the left side of the board and is placed in a way that will help airflow also. BTX based boards will require cases that are made specifically for BTX form factor motherboards. When you are planning to put together a BTX system you need to make sure to get the right size case for the type of BTX board that you are planning to use.  

   Intel Desktop Board D915GMH  (Digital Office Version) 
 
When assembling parts for a BTX system, after the motherboard, CPU heatsink and chassis are selected, any standard compatible parts can be used.  Only the motherboard, CPU heatsink and case must be specifically designed for BTX form factor.  There are just a 
                                                                             
  • Hard Drives
  • Memory 
  • Optical drives
  • Floppy drives
  • PCI-express Video cards
  • Other PCI and PCI-express cards
  • Power Supplies (depending on case size and type)

BTX Motherboards

ASI SKU Manufacturer Model Form Factor Features
33133 (retail box), 33135 (pack) Intel D915GMHL microBTX
(10.50" x 10.40")
  • Onboard VGA
  • LGA775
  • DDR400
  • 1 x PCI Express x16
  • 1 x PCI Express x1
  • LAN
33134 (retail box), 33136 (pack) Intel D915GMHLK microBTX
(10.50" x 10.40")
  • Onboard VGA
  • LGA775
  • DDR400
  • 1 x PCI Express x16
  • 1 x PCI Express x1
  • Gigabit LAN

Intel Boxed Processors for BTX Type 1 - NO ASI SKU AVAILABLE AT THIS TIME

ASI SKU Processor Product Code Clock Speed FSB L2 Cache Socket HT XD Thermal Solution
35583 Processor 560J*  BX80547PG3600ET 3.6 GHz 800 MHz 1 MB LGA775 Yes Yes BTX Type I
Not available at this time Processor 550J* BX80547PG3400ET 3.4 GHz 800 MHz 1 MB LGA775 Yes Yes BTX Type I
Not available at this time Processor 530J* BX80547PG3000ET 3.0 GHz 800 MHz 1 MB LGA775 Yes Yes BTX Type I

*Do not confuse with ATX versions of these CPU models which have similar names!  The heatsinks are different.

BTX cases

ASI SKU Brand Model Form Factor / Size Power Supply Color
35019 Chenbro PC30769-BK-300W Micro BTX / Mini Tower 300W PS ATX 12V Ver 2.0 Black
35256 Aopen B300A Micro BTX /  Slim Case 275W CFX 12V high efficiency switching power supply  Black

The time is almost here!

While components have began arriving at distributors in small quantities, full system configurations are not yet available. By Q2, 2005 you should be able to get all the components you need to start building your BTX systems. Like with any new product, we expect stock to be tight at first, many companies are waiting for the technology and are working hard to become the early adopters of this new design. Stay in close contact with your ASI Tech Support Staff so you'll be able to get them as soon as possible.


Preview - New Performance Features for SATA II

SATA II (or SATA 2.0) is the next generation of the now popular and widespread SATA 1 SERIAL ATA technology.

What's the real difference between SATA I and SATA II? The first one is the bandwidth or communication speed. 

SATA I: Support 1.5 Gb per second bandwidth

SATA II: Supports 3.0 Gb per second plus new features including Port multipliers, Port selectors and Native command queuing

But in addition SATA II will be better suited for enterprise environments because of three important features, port multipliers, port selectors and native command queuing:

Port Multipliers:

A Port Multiplier is a mechanism for one active host connection to communicate with multiple devices. A Port Multiplier can be thought of as a simple multiplexer where one active host connection is multiplexed to multiple device connections Only one active host connection to the Port Multiplier is supported. The Port Multiplier is an adaptable design that supports up to 15 device connections and utilizes the full bandwidth of the host connection. Although this is less than the number of drives that can be connected using Fiber Channel or Serial Attached SCSI (SAS), this will make it much easier to build disk enclosures using SATA drives.

Port Selectors:

Port selectors will allow two hosts to be connected to one drive. This is useful because it creates a redundant connection to the disk drive. In this way if one of the hosts has a failure, the second host, acting as a spare, can take over and access to the storage is maintained. This sort of redundancy is essential for enterprise environments.

Native Command Queuing (NCQ):

Native command queuing will improve the performance and efficiency of SATA II drives. Normally commands will arrive at a disk to read or write from different locations on the disk. When commands are executed in the order they arrive, a great deal of mechanical overhead is created when the read/write head is constantly being repositioned. SATA II drives will use an algorithm to determine the most efficient order to execute commands, which creates the least mechanical overhead. In this way native command queuing will improve the performance of SATA II.

Command queuing, as its name suggests, allows commands to be queued up, read and reordered before the driver acts upon data. The technology was defined as early as the ATA-4 specification, with the host controller determining the order of the commands to process. Native command queuing, part of the Serial ATA specification, allows up to 32 instructions to be queued and reordered by the hard disk controller itself.

Native Command Queuing (NCQ)

NCQ is designed to improve performance and reliability as the transactional workload increases - When your application sends multiple commands to your drive, your drive can optimize the completion of these commands to reduce mechanical workload and improve performance.

  • NCQ works in all systems supporting SATA NCQ from desktop PCs, workstations; digital media content servers, entry servers to high performance PCs and mobile/notebook systems.
     
  • NCQ allows the device to reorder commands for more efficient data transfers.
     
  • Devices that support NCQ are 100% backward compatible with non-NCQ supporting systems.
EXTERNAL SATA CONNECTORS

 

SATA II also introduce an external connector interface. Here is the external single lane connector. The external cable connector is a shielded version of the connector specified in SATA 1.0a with these basic differences:

  • The External connector has no “L” shaped key, and the guide features are vertically offset and reduced in size. This prevents the use of unshielded internal cables in external applications.
     

  • To prevent ESD damage, the insertion depth is increased from 5mm to 6.6mm and the contacts are mounted further back in both the receptacle and plug.
     

  • To provide EMI protection and meet FCC and CE emission requirements, the cable has an extra layer of shielding, and the connectors have metal contact points.
     

  • There are springs as retention features built into the connector shield on both the top and bottom surfaces.

The external connector and cable are designed for over five thousand insertions and removals while the internal connector is only specified to withstand fifty insertions.


 

Hitachi's will ship three SATA 2 drives, all running at 7,200rpm, and with a capacity of 500GB, 250GB and 80GB. The new drives also include an error correction code feature that protects customer data throughout the drives’ circuits.

The drives include another key feature of SATA II, staggered spin-up. Staggered, or delayed, spin-up enables the host to individually “spin-up” drives in multi-drive configurations. This reduces the power draw of a booting system, enabling system designers to reduce the size of the power supply and minimize the total cost of ownership for end-users.

The next generations of chipset will have support for SATA II. Glenwood, Lakeport and Smithfield will support Serial ATA 2. Smithfield, "The 955 and 945 chipsets are said to provide four SATA 2 ports, Matrix RAID, Hi-Def audio". Seagate New Barracuda drives with 400, 300, 250, 200, 120 and 100GB of capacity will have the new SATA II (NCQ).

Original Websource: www.asisupport.com > www.asipartner.com