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February 2005 |
Downloadable
Version (.pdf format) |
Volume
4, Issue 1 |
| In
This Edition:
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Welcome to another edition of the
ASI CORP Technical Newsletter! This newsletter features articles on new and current
computer technologies and products sold by ASI and our vendors. If you
are an ASI customer feel free to call Technical Support Staff if you
have any questions. Please visit www.asisupport.com
(general technical help), www.asiserver.com
(server solutions), or www.asimobile.com
(notebook support and configuration) for further information. Thank
you.
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Intel has officially announced the Next Generation
Centrino™ mobile technology on January 19, 2005.
The Next Generation Centrino™ mobile expands on the technologies
of the
first generation key components such as i855 chipset family,
Pentium M mobile processor, and PRO/Wireless network.
In addition, the Next Generation Centrino™ mobile enhance
the three key components to deliver greater performance,
multiple wireless LAN capability, greater battery life, and
thinner/lighter designs. Inside the Next Generation Centrino™
mobile consists Intel® Pentium® M processor with up to
533 MHz FSB, Mobile Intel® 915 Express chipset
family, and Intel® PRO/Wireless Network Connection family.
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The 1st notebooks utilizing
the Next Generation
Centrino™ mobile technology are now available through
ASI. The
Z71A Whitebox notebook (ASI SKU# 34809) is now in stock
and ready to be custom built for you! |
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The Intel®
Pentium® M Processor is the first
component solution
for Intel Centrino™ mobile technology. Based
on the first generation Pentium M processor
architecture aka "Dothan", the new Pentium
M processor offer 533-MHz front side bus (FSB) high
performance and many new enhancements. With an
increase of 400FSB to 533FSB, this gave the new
Pentium M processor a 33% increase in performance at
same clock level.
Furthermore, it reduces latencies
between high speed PC2700 (333MHz) memory given the
processor and memory synchronous operation at
133MHz. The outcome of this is faster execution of
instructions for daily active applications, hardcore
games, graphic rendering, & multimedia
encoding/decoding.
|
|
| * |
Key
features of the new Pentium M processor
| Features |
Benefits |
| Power
Optimized 533/400 MHz processor system bus,
Micro-ops Fusion & Dedicated Stack Manager |
Allows
faster execution of instructions at lower power. |
| Support
for enhanced Intel SpeedStep® technology w/
multiple voltage & frequency operating points. |
Allows
for better match of performance to application
demand. which enables real-time dynamic switching
between multiple voltage and frequency points. This
results in optimal performance without compromising
low power. The processor features the Auto Halt,
Stop Grant, Deep Sleep, and Deeper Sleep low power
states. |
| Execute
Disable Bit (XD) Support |
Can
help prevent certain classes of malicious “buffer
overflow” attacks when combined with supporting
operating system. This is an optional feature and is
available on the latest Intel® Pentium® M
Processors. |
| Support
for Intel® Mobile Voltage Positioning (Intel® MVP
IV) |
Dynamically
lowers voltage based on processor activity to lower
thermal design power enabling smaller notebooks. |
| Micro
FCPGA & FCBGA packaging technology |
Optimized
for a range of thinner, lighter designs including
<1” thick that deliver outstanding performance. |
|
| * |
Intel
Mobile Processor with embedded Execute Disable Bit (XD)
| |
ASI
SKU |
Processor
Number |
Processor
Generation (Architecture) |
Clock
Speed |
Front
Side Bus |
Cache |
XD |
| Intel®
Pentium® M
Processor |
|

|
| 35159
|
770
|
Dothan
90nm |
2.13
GHz |
533
MHz |
2MB
L2 |
Yes |
| 35158
|
760
|
Dothan
90nm |
2.00
GHz |
533
MHz |
2MB
L2 |
Yes |
| 35157
|
750
|
Dothan
90nm |
1.86
GHz |
533
MHz |
2MB
L2 |
Yes |
| 35156
|
740
|
Dothan
90nm |
1.73
GHz |
533
MHz |
2MB
L2 |
Yes |
| 35155
|
730
|
Dothan
90nm |
1.60
GHz |
533
MHz |
2MB
L2 |
Yes |
|
|
- Click
here for Intel Pentium® M Processor overview
- Click
here for Intel Pentium® M Processor Spec
Finder
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Mobile
Intel 915 Express Chipset (aka Alviso) family
platform is the second
component solution
for Intel Centrino™ mobile technology.
The Mobile Intel 915 Express Chipset is packed with
the latest technology found on desktop main board
Intel 915 Chipset Family such as Intel Graphics
Media Accelerator 900, PCI Express x16, PCI Express
x1, DDR2-400/533 Dual/Single Channel, Serial ATA
150, and High Definition Audio. Notebook with
these technology, performance is flawlessly. There
are four flavor to Mobile Intel 915 Express Chipset.
They have their different features, different use,
and different price depends on system manufacturers
targets. |
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| * |
Mobile
Intel® 915/910 Express Chipset Comparison:
| |
Chipset
Family |
Special
Features (features mark in blue
distinguish then from its sibling) |
|
Mainstream
|
Mobile
Intel® 915PM Express Chipset |
Supports
533/400FSB Processors, PCI
Express x16 based graphics, PCI Express
x1(ExpressCard), DDR2-400/533 Dual/Single Channel
memory, Serial ATA, ATA100, USB2.0, Ethernet LAN,
Wi-Fi LAN, and Intel® High Definition Audio. |
|
Performance
|
Mobile
Intel® 915GM Express Chipset |
Supports
533/400FSB Processors, Intel®
Graphics Media Accelerator 900, PCI
Express x1(ExpressCard), DDR2-400/533 Dual/Single
Channel memory, Serial ATA, ATA100, USB2.0, Ethernet
LAN, Wi-Fi LAN, and Intel® High Definition Audio. |
|
|
- Click
here for Mobile
Intel 915 Express Chipset Matrix Chart
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The Intel®
PRO/Wireless Network Connection is the integrated
Wireless LAN (WLAN), which is the third
component solution
for Intel Centrino™ mobile technology. The
new PRO/Wireless (2915ABG) is a single, a
dual band, and a tri-mode solutions.
It supports Wi-Fi
standard single band (802.11b), dual band
(802.11a/b), dual mode (802.11b/g), and tri-mode
(802.11a/b/g). With the multi-mode technology, it
provides freedom and flexibility to work and play on
the go. It connects through wireless LAN
networks at home, office, hotels, airports, or any
location with Wi-Fi Alliance standard signal.
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| * |
|

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| Intel®
PRO/Wireless 2915ABG (WM3B2915ABG) Network
Connection (Tri-mode 802.11a/b/g) |
ASI
SKU # 31096 |
|
| Features |
Benefits |
| Wi-Fi
CERTIFIED |
Wi-Fi
CERTIFIED for 2.4 GHz and 5 GHz band, WMM CERTIFIED,
WPA and WPA2 |
| WLAN
Standard |
IEEE
802.11a, IEEE 802.11b, IEEE 802.11g, 802.11d,
802.11h, 802.11i, and 802.11e |
| Operating
Frequency |
- 5 GHz UNII:
Orthogonal Frequency Division Multiplexing (OFDM)∞
for 802.11a
- 5 GHz UNII:
Orthogonal Frequency Division Multiplexing (OFDM)∞
for 802.11a
- 2.4 GHz ISM:
Direct Sequence Spread Spectrum (DSSS) for
802.11b
|
| Performance |
Typical
indoor range of 40 ft (12 m) @ 54 Mbps / 300 ft (91
m) @ 6 Mbps for 802.11a, 100 ft (30 m) @ 11 Mbps /
300 ft (90 m) @ 1 Mbps for 802.11b, 100 ft (30 m) @
54 Mbps / 300 ft (91 m) @ 1 Mbps for 802.11g
Intel® Wireless Coexistence System support enables
reduced interference between Intel PRO/Wireless
& certain Bluetooth devices.For systems designed with two antennas, real-time
antenna selection enables optimized WLAN
performance. Real-time temperature calibration dynamically
optimizes wireless performance by adjusting output
power to temperature changes for increased
throughput & range with 802.11a radio. |
| Security |
| I.
Authentication |
| II.
Encryption |
|
| S |
| I.
LEAP, WPA, 802.1X, EAP-TLS, EAP-FAST, PEAP |
| II.
CKIP, TKIP, 128-bit and 64-bit WEP, Hardware
AES |
|
| Intel®
PROSet Software |
- Easy-to-use
interface with Intel® Smart Wireless Solutions
support
- IT Configuration
Utility
- Single Sign On
support
- Centralized
Profile Management
- EAP-SIM support
- Supports Cisco,
Check Point Software Technologies, Microsoft and
Intel VPN connections.
- Support
Microsoft Windows XP (Professional, Home,
Tablet) & Windows 2000
|
| Power
Management |
Intel®
Intelligent Scanning Technology reduces power by
controlling the frequency of scanning for access
points. A user selectable feature with five different Power
states, which allows the user to make their own
power vs. performance choices when in battery mode. |
|
| * |
- Click
here for Intel PRO/Wireless 2915ABG Overview
(PDF file)
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| Networked
Attached Storage & ReadyNAS 600 |
| Growing
Storage Needs Require New Solutions |
For
many small to medium businesses their server and network
storage needs can quickly outgrow the capacity of their
server systems. It can be difficult and expensive to
increase the capacity of working servers and companies risk
costly downtime
during such upgrades. One clear solution is the use of NAS
devices.
NAS stands for Network
Attached Storage meaning dedicated storage devices connected
to your LAN instead of directly connected to a system or
server. Such devices can take several forms but a true NAS
device is designed only for storage not for running
applications, therefore saving the costs of expensive
motherboards, processors and software required to make a
full file server.
A NAS device can just be
attached to the network via standard Ethernet cables and
quickly configured to serve your storage or backup needs.
It does not require costly server upgrade or downtime and
usually offers more universal compatibly with different
types of operating systems.
Click
here for a diagram of typical NAS device layout
|
| Hot
New Product! ReadyNAS 600 |
Until
now most NAS devices were expensive and required technical
expertise to setup. No longer is this true!
ASI is now offering a
flexible, cost-effective, and easy to use NAS product from a
company called Infrant Technology (www.infrant.com).
This product is called ReadyNAS 600. It is the
world's smallest RAID 5 NAS device and uses SATA drives for
maximum capacity and uses a powerful 32-bit RISC Network
Storage Processor.
The ReadyNAS 600 series is
easy to use because of Infrant's embedded OS called
"RAIDiator." RAIDiator™ is Infrant's own
embedded operating system that exploits the features of the
Infrant ReadyNAS™ Network Storage System board.
With the built-in FrontView™
Setup Wizard, whether an ReadyNAS box is being used by an
advanced IT wizard or a novice
home user, setting up the NAS is a breeze. It can be used
for backup, file sharing and storage, digital media storage,
and much more.
Other key features built into
the ReadyNAS 600 products is the ability to add a hot-spare
hard drive for improved data protection, background RAID
synchronization to get started fast, ability to set disk
quotas, built in print server (connect two printers to USB
ports), compatible with many operating systems, Gigabit
Ethernet interface, ability to take snapshots of data that
can be later restored, three different security modes,
online updates, and much more.
There are two product SKU #
detailed in the table below:
|
| ASI
SKU |
Model |
Max
Drives |
Max
Capacity |
Interfaces |
RAID
Levels |
Special
Features |
| 34426 |
ReadyNAS
RN606 |
4
SATA drives |
640
Gigabytes |
Gigabit
Ethernet (RJ45), Two USB 2.0 ports |
Hardware
RAID 0, 1, and 5 |
DHCP
and static IP support, compatible with Windows,
MAC, Unix and Linux systems, built-in print server |
| 34431 |
ReadyNAS
RN610 |
4
SATA drives |
1
Terabyte |
Gigabit
Ethernet (RJ45), Two USB 2.0 ports |
Hardware
RAID 0, 1, and 5 |
DHCP
and static IP support, compatible with Windows,
MAC, Unix and Linux systems, built-in print server |
|
| Here
is a screenshot of the RAIDiator setup wizard: |
|

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| Recommended
SATA Hard Drives for RAID |
| ASI
SKU |
Brand |
Model |
Type |
Capacity |
Speed |
Specs |
Interface |
| 29718 |
Western
Digital |
WD2500SD |
Western
Digital Caviar RAID Edition |
250GB |
7200rpm |
8MB |
SATA
150 |
| 20304 |
Western
Digital |
WD360GD |
Raptor
drives |
36GB |
10,000RPM |
8MB |
SATA
150 |
| 22139 |
| 25229 |
Western
Digital |
WD740GD |
Raptor
drives |
74GB |
10,000RPM |
8MB |
SATA
150 |
| 26929 |
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| Introduction
to Balanced Technology Extended (BTX) |
| A
new PC Form Factor emerges |
| Starting in late Q4,
2004, distributors began receiving and selling products based on the BTX
form factor. Since this is an entirely new product, we are going to
present you with a brief overview which will allow you to better
understand the technology behind BTX technology and all that it
encompasses.
In the beginning...
At the Intel Developers Forum in the
Fall of 2003 Intel announced the specifications for the new scalable form
factor, BTX. The BTX (Balanced Technology
Extended) form factor was designed to provide better routing, thermals and
structural support for upcoming new technologies. The new board
layout and design allows the use of low profile case designs with better
performing CPU's. The current ATX technology was introduced back in 1995,
I think you'd agree that a lot has changed since then. ATX has been
struggling to keep up with the power and thermal demands that have been
placed on it since the advent of the P4 and the time has finally come to
stand aside and let it's successor take it's place.
Why the need for a
change?
While ATX had many improvements over
it's previous technologies, it has reached the limit of what can be done
to modify it's design in order to make new technology work. ATX form
factor designs were never meant to scale to fit smaller applications,
therefore any smaller system boards that were needed were difficult to lay
out and costly to design. The BTX form factor was designed with
scalability in mind. From the beginning it has been planned with 3
standard board sizes and 2 thermal module designs (type I and type II).
Type I (Standard Height) Thermal Modules are designed to support system
sizes ranging from full towers down to small form-factor (SFF) machines.
Type II (Low Profile) Thermal Modules are designed to support ultra-thin,
ultra-small form-factor systems. |
BTX Board
Sizes
 |
 |
 |
| microBTX
|
BTX
|
picoBTX
|
- 10.4" x 10.5"
(264.16mm)
- Up to 4 Expansion Slots
- Est. Arrival Q4, 2004
- Thermal Module Type I
|
- 12.8" x 10.5"
(325.12mm)
- Up to 7 Expansion Slots
- Est. Arrival Q2, 2005
- Thermal Module Type I
|
- 8.0" x 10.5"
(203.20mm)
- Up to 2 Expansion Slots
- Est. Arrival Q3, 2005
- Thermal Module Type II
|
In addition to the scalability of
the BTX form factor, many other issues have been addressed as well. With
the increased power requirements of modern processors there have been
several items that have needed to be changed. Increased power means
increased heat. While looking at all of the options you now have available
to cool modern systems, some of them have become ridiculously expensive.
Besides the standard heatsink route, people have now began water cooling
systems or even going as far as using peltier cooling, or even in some
cases cryo cooling (recirculatory refrigeration). Granted, those last few
methods are mainly for the die hard system cooling crowd, but even the
most modest of power users has now taken to, at the very least, filling
his case with extra fans to protect his computing investment. All of this
cooling comes at a price... and I'm not just talking about financial. I've
personally been guilty of adding so many fans to my case that it makes it
practically impossible to sleep in the house at night due to all of the
noise. BTX addresses both of these issues.
The sound of silence
Ok, well maybe it's not silence, but
it's much closer than we have been in several years. One of the advantages
of BTX design is the effect that it has on the thermals of the system
allowing the air to flow better through the case due to the placement of
the slots and the positioning of the cabling. The design of the board
routes the airflow in the case from across the front of the board where
the CPU is positioned, then across the chipset and past the 16x PCI
express slot then out the back of the case. Looking at the pictures
below of the fan bottoms, you can see that the new Thermal solution has
been designed to also provide a nice airflow under the motherboard to add
additional cooling. Acoustically the new design is better because it only
requires two fans, the thermal module fan and the power supply fan.
BTX Thermal Fans
 |
 |
 |
| Low
Profile thermal Fan |
Type
I mainstream Thermal Fan top |
Type
I Performance thermal Fan top |
 |
 |
 |
| Type
I Standard thermal Fan |
Type
I mainstream Thermal Fan bottom |
Type
I Performance thermal Fan bottom |
Better routing through
new technology
As was mentioned earlier, one of the
problems with the ATX form factor design is that it does not easily lend
itself to be modified for use in different (usually smaller) devices. The
routing and component placement in ATX has become increasingly complex
through the years as the need for different components have been added to
the board. The area around the core had become saturated and there were
definitely issues in the MCH-to-memory routing path.
The BTX design has a clean ICH-to-I/O
routing path, and has also increased the rear Panel I/O capacity and
improved MCH-to-memory routing length. A fresh board design has allowed
components to be placed in the most logical positions when considering
power requirements, partner components, and thermal requirements instead
of trying to stuff them in wherever they would fit on a crowded
motherboard. There has also been a slight increase in board area when
comparing microBTX to microATX or in comparing BTX to ATX. The core
components are stable as you scale the board from picoBTX to microBTX, and
onto BTX.
How about some products?
Below is a picture of Intel's D915GMH
(Digital Office) motherboard, they will have a Digital home version also. You
can see that the layout of the board is designed to provide much better
airflow. The memory has been moved to the left side of the board and
is placed in a way that will help airflow also. BTX based boards will
require cases that are made specifically for BTX form factor motherboards.
When you are planning to put together a BTX system you need to make sure
to get the right size case for the type of BTX board that you are planning
to use. |
 |
|
Intel Desktop Board D915GMH (Digital Office Version) |
| |
| When
assembling parts
for a BTX system, after the motherboard, CPU heatsink and chassis are
selected, any standard compatible parts can be used. Only the motherboard,
CPU heatsink and case must be specifically designed for BTX form
factor. There are just a |
- Hard Drives
- Memory
- Optical drives
- Floppy drives
|
- PCI-express Video cards
- Other PCI and PCI-express cards
- Power Supplies (depending on
case size and type)
|
BTX Motherboards
| ASI
SKU |
Manufacturer |
Model |
Form
Factor |
Features |
| 33133
(retail box),
33135 (pack) |
Intel |
D915GMHL |
microBTX
(10.50" x 10.40") |
- Onboard VGA
- LGA775
- DDR400
- 1 x PCI Express x16
-
1 x PCI Express x1
- LAN
|
| 33134
(retail box),
33136 (pack) |
Intel |
D915GMHLK |
microBTX
(10.50" x 10.40") |
- Onboard VGA
- LGA775
- DDR400
-
1 x PCI Express x16
-
1 x PCI Express x1
- Gigabit LAN
|
Intel Boxed Processors for BTX Type 1
- NO ASI SKU AVAILABLE AT THIS TIME
| ASI
SKU |
Processor |
Product
Code |
Clock
Speed |
FSB |
L2
Cache |
Socket |
HT |
XD |
Thermal
Solution |
|
35583 |
Processor
560J* |
BX80547PG3600ET |
3.6
GHz |
800
MHz |
1
MB |
LGA775 |
Yes |
Yes |
BTX
Type I |
| Not
available at this time |
Processor
550J* |
BX80547PG3400ET |
3.4
GHz |
800
MHz |
1
MB |
LGA775 |
Yes |
Yes |
BTX
Type I |
| Not
available at this time |
Processor
530J* |
BX80547PG3000ET |
3.0
GHz |
800
MHz |
1
MB |
LGA775 |
Yes |
Yes |
BTX
Type I |
*Do not confuse with ATX
versions of these CPU models which have similar names! The heatsinks
are different.
BTX cases
| ASI
SKU |
Brand |
Model |
Form
Factor / Size |
Power
Supply |
Color |
| 35019 |
Chenbro |
PC30769-BK-300W |
Micro BTX
/ Mini Tower |
300W PS ATX 12V Ver 2.0 |
Black |
| 35256 |
Aopen |
B300A |
Micro BTX
/ Slim Case |
275W CFX 12V high efficiency switching power supply |
Black |
The time is almost here!
While components have began arriving at
distributors in small quantities, full system configurations are not yet
available. By Q2, 2005 you should be able to get all the components you
need to start building your BTX systems. Like with any new product, we
expect stock to be tight at first, many companies are waiting for the
technology and are working hard to become the early adopters of this new
design. Stay in close contact with your ASI Tech Support Staff so you'll be able to get them as soon as possible. |
|
|
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|
Preview
- New Performance Features for SATA II
|
| SATA
II (or SATA 2.0) is the next generation of the now
popular and widespread SATA 1 SERIAL ATA technology.
What's
the real difference between SATA I and SATA II? The
first one is the bandwidth or communication
speed.
SATA
I: Support 1.5 Gb per second bandwidth
SATA
II: Supports 3.0 Gb per second plus new features
including Port multipliers, Port selectors and Native
command queuing
But in
addition SATA II will be better suited for
enterprise environments because of three important
features, port multipliers, port selectors and native
command queuing:
Port
Multipliers:
A Port Multiplier is a mechanism for one active host connection to communicate with multiple devices. A Port Multiplier can be thought of as a simple multiplexer where one active host connection is multiplexed to multiple device connections
Only one active host connection to the Port Multiplier is supported. The Port Multiplier is an
adaptable design that supports up to 15 device connections and utilizes the full bandwidth of the host connection.
Although this is
less than the number of drives
that can be connected using Fiber Channel or Serial
Attached SCSI (SAS), this will make it much easier to
build disk enclosures using SATA drives.
Port
Selectors:
Port selectors
will allow two hosts to be connected to one drive.
This is useful because it creates a redundant
connection to the disk drive. In this way if one of
the hosts has a failure, the second host, acting as a
spare, can take over and access to the storage is
maintained. This sort of redundancy is essential for
enterprise environments.
Native
Command Queuing (NCQ):
Native command queuing will improve the performance
and efficiency of SATA II drives. Normally commands
will arrive at a disk to read or write from different
locations on the disk. When commands are executed in
the order they arrive, a great deal of mechanical
overhead is created when the read/write head is
constantly being repositioned. SATA II drives will use
an algorithm to determine the most efficient order to
execute commands, which creates the least mechanical
overhead. In this way native command queuing will
improve the performance of SATA II.
Command queuing, as its
name suggests, allows commands to be queued up, read
and reordered before the driver acts upon data. The
technology was defined as early as the ATA-4
specification, with the host controller determining
the order of the commands to process. Native command
queuing, part of the Serial ATA specification, allows
up to 32 instructions to be queued and reordered by
the hard disk controller itself.

Native
Command Queuing (NCQ)
NCQ
is designed to improve performance and reliability as
the transactional workload increases - When your
application sends multiple commands to your drive,
your drive can optimize the completion of these
commands to reduce mechanical workload and improve
performance.
-
NCQ works in all
systems supporting SATA NCQ from desktop PCs,
workstations; digital media content servers,
entry servers to high performance PCs and
mobile/notebook systems.
-
NCQ allows the
device to reorder commands for more efficient
data transfers.
-
Devices
that support NCQ are 100% backward compatible
with non-NCQ supporting systems.
|
| EXTERNAL
SATA CONNECTORS |
|

SATA II
also introduce an external connector interface. Here
is the external single lane connector. The external
cable connector is a shielded version of the connector
specified in SATA 1.0a with these basic differences:
-
The
External connector has no “L” shaped key, and
the guide features are vertically offset and
reduced in size. This prevents the use of
unshielded internal cables in external
applications.
-
To
prevent ESD damage, the insertion depth is
increased from 5mm to 6.6mm and the contacts are
mounted further back in both the receptacle and
plug.
-
To
provide EMI protection and meet FCC and CE
emission requirements, the cable has an extra
layer of shielding, and the connectors have metal
contact points.
-
There
are springs as retention features built into the
connector shield on both the top and bottom
surfaces.
The external connector
and cable are designed for over
five thousand insertions and removals while
the internal connector is only specified to withstand fifty
insertions.

|
| Hitachi's
will ship three SATA 2 drives, all running at
7,200rpm, and with a capacity of 500GB, 250GB and
80GB. The new drives also include an error correction
code feature that protects customer data throughout
the drives’ circuits.
The drives include
another key feature of SATA II, staggered spin-up.
Staggered, or delayed, spin-up enables the host to
individually “spin-up” drives in multi-drive
configurations. This reduces the power draw of a
booting system, enabling system designers to reduce
the size of the power supply and minimize the total
cost of ownership for end-users.
|
| The
next generations of chipset will have support for SATA
II. Glenwood, Lakeport and Smithfield will support
Serial ATA 2. Smithfield, "The 955 and 945
chipsets are said to provide four SATA 2 ports, Matrix
RAID, Hi-Def audio". Seagate New Barracuda drives
with 400, 300, 250, 200, 120 and 100GB of capacity
will have the new SATA II (NCQ). |
|
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