New Intel Centrino Core Duo Mobile Technology
Intel's new Centrino Core Duo has revolutionized the mobile experience. The introduction of Dual Core Technology to the mobile theater will let the personal and professional user do more then ever before with their notebooks. With the combination of the new Intel Mobile 945 Express Chipset and the Intel Pro/Wireless 3945ABG Network connection the mobile experience will be unparalleled.

Key Components to be Centrino Duo Certified Notebook

  • Intel Core Duo Processor

  • Intel Mobile 945 Express Chipset

  • Intel Pro/Wireless 3945ABG Network Connection

 

** You will also need a compatible notebook shell to install these parts. ASI Currently has the new ASUS Z62F model which has two ASI SKU # 44637 (CDRW drive) & # 45734 (DVDRW drive). More details coming soon to www.asimobile.com **

 

 

What is "NAPA"?

Now the combination of the Core Duo processor, 945 Express chipset and the 3945ABG wireless solution is what is known as the "Napa" platform.  In other words, the code name for Centrino Duo is Napa.  Its predecessor is "Sonoma" which is the code name for the Centrino platform that was composed of Intel’s Pentium M (based on Dothan), 915 chipset and 2915ABG wireless solution. 

Increased Speeds

Napa increases the FSB from 533MHz to 667MHz and increases the memory from DDR2 533MHz to DDR2 667MHz. With DDR2 667MHz there will be better performance for the integrated graphics and lower latency memory access to run synchronous with the 667MHz FSB.

The Benefits of Dual Core Mobile Technology

  • Revolutionary Mobile Performance

  • Increased Memory & Front Side Bus speeds to DDR2 667MHz (still backward compatible 533)

  • Lower Power consumption for better battery life

  • Expanded wireless connectivity

  • Smaller hardware form factor

A look at both processors

Dothan and Yonah are NOT pin-compatible.
Dothan Core Duo "Yonah" "Dothan"                                   Core Duo "Yonah"
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The Yonah technology is based on the 65 nm fabrication process. and when compared to the Dothan CPUs the die shrink allow Intel to place more transistors into the same surface area. Which also helps to reduce some of the production costs.

Both of Yonah's cores only populate a surface area of 90.3 mm2, that includes a 2 MB L2 cache, with the transistor count of 151 million. This die is slightly larger than the Dothan Processor  with a single core which includes roughly 140 million transistors on a surface area of 83.6 m2
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Core Duo Key Features
  • Smart Cache
  • Dynamic Power Coordination
  • Digital Media Boost
Smart Cache
  • One of the benefits of the smart cache is that both cores have full access of the 2MB L2 cache and can dynamically allocate the cache for the best and fastest access.
  • The Core Duo Processor also shares data between the two cores for the most efficiency possible.
  • This CPU also is equipped with Enhanced Data Pre-Fetch Logic to enhance the access to the L2 cache.
Dynamic Power Coordination The Intel Core Duo processor delivers dual-core coordinated performance on demand, with enhanced power management to reduce power consumption and help preserve battery life. The shared Power Management Logic coordinates Enhanced Intel SpeedStep Technology and idle power-management state (C-states) transitions in HW to efficiently manage voltage and frequency. This also enables the two execution cores to independently and dynamically transition to Halt, Stop Clock, and Deep Sleep low-power states. This means that if only one core is being utilized, the second core can still enter an idle state to help save power.
Digital Media Boost The Intel Core Duo processor features micro-architectural enhancements for improved floating point capability, including instruction optimizations and performance enhancements for existing Streaming SIMD Extensions 2 (SSE2). In addition to enhancing the performance of existing Streaming SIMD Extensions 2 (SSE2), there are 13 new instructions that further extend the capabilities of Intel® processor technology. These new instructions are called Streaming SIMD Extensions 3 (SSE3), first introduced on the Intel® Pentium® 4 Processor, with their implementation fully optimized specifically for the Intel Core Duo processor Architecture.
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These instructions accelerate activities such as complex arithmetic, graphics, and synchronization of multiple threads. The Intel Core Duo processor also features other floating point performance enhancements such as a faster integer divide and updated micro-ops fusion. These new micro-architectural enhancements lead to improved throughput and performance.  With all the Enhanced technology and features that create this new Centrino Core Duo it take mobile technology to a new level for the personal user and the professional user.
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Specifications

Processor Number Cache Clock Speed Front Side Bus Power Dual-Core Enhanced Intel SpeedStep® Technology Execute Disable Bit
 65 nm
T2600 2 MB L2 2.16 GHz 667 MHz 31W
T2500 2 MB L2 2.0 GHz 667 MHz 31W
T2400 2 MB L2 1.83 GHz 667 MHz 31W
T2300 2 MB L2 1.66 GHz 667 MHz 31W
The Intel Core Solo Processor is another integral part of the next generation of mobile processing. This is a new single core processor that is optimized for optimal power consumption. This processor targets the demanding applications such as Cad tools, 3D & 2D modeling, video editing, digital music, digital photography and gaming. The Core Solo is a single core version of the Core Duo.

Specifications

Processor Number  Cache Clock Speed Front Side Bus Power Dual-Core Enhanced Intel SpeedStep® Technology Execute Disable Bit
 65 nm
T1300 2 MB L2 1.66 GHz 667 MHz 27W

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Intel Mobile 945 Express Chipsets

The Mobile i945 Express Chipset (aka "Calistoga") is another part of the equation to the Napa platform similar to last generation Sonoma platform which offer power, mobility, and connectivity.  In addition, the 945 Express is promise to offer everything what it's predecessor Sonoma have, and much more.  The 945 Express chipset is a redesign of the 915 Express chipset, which is still being develop in 130nm process but promise lower power consumption and faster clock.

The new ICH7M (Southbridge) incorporates more aggressive clock gating (turning off the clock supplied to various blocks of the ICH when not in use) and IO buffer gating (turning off the IO buffers when not in use) to achieve lower power usage.  The front side bus (FSB) has been increase from 533MHz to 667MHz, which is a 25% increase in performance, dual-channel DDR2-667 (10.67 GB/sec), Intel GMA950 (2x improvement in graphics performance), PCIe x1 I/O interface (3.5x the bandwidth), and so forth.  Intel launches two version of the mobile 945 Express chipset: mainstream chip mobile 945GM Express and performance chip mobile 945PM Express. 

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Performance Class

Mainstream Class
Mobile Express Chipset
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Click here to enlarge

Intel® 945PM Express Chipset

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Click here to enlarge
Intel® 945GM Express Chipset
Features: Benefits:
667 MHz Front Side Bus Supports Intel® Core™ Duo and Intel® Core™ Solo processors with up to 25% faster data transfer rate compared to the previous generation bus speed.
Dual-channel DDR2 667MHz Memory Support Up to 10.7 GB/s of bandwidth and up to 4GB memory addressability, for faster system responsiveness (still backward compatible 533). Memory Validation by Intel
PCI Express* x16 Interface Delivers greater than 3.5 times the bandwidth over the traditional AGP interface and supports the latest high-performance graphics cards.

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PCI Express* x1 Interface Offers up to 3.5 times the bandwidth over traditional PCI architecture, delivering faster access to peripheral devices and networking.
Intel® Graphics Media Accelerator (GMA) 950 - Exceptional 3D graphics performance for corporate and consumer laptops.
Full D-connector support (D1-D5) - Enables ease of use for optimally enjoying TV content through D-connector enabled devices.
COPP/HDCP/CGMS-A support - Enables user to view protected premium video content to be displayed while providing content protection.
Intermediate Z in classic mode - Intelligent polygon rendering for enhanced 3D graphics performance.
Adaptive de-interlacing - Enables enhanced visual quality of interlaced content on progressive displays.
Intel Matrix Storage Technology Enables enhanced performance, power management and data protection for the storage subsystem.
Intel® High Definition (HD) Audio Integrated audio support enables premium sound and delivers advanced features such as multiple audio streams and jack re-tasking. The Dolby* PC Entertainment Experience1 is available exclusively on systems with Intel High Definition Audio.
Integrated high speed USB 2.0 Support for 8 USB 2.0 peripherals for maximum 40x faster data transfer and backward compatible to support USB 1.1 devices.
Operating System Support Windows XP Professional, Home, Media Center, and Tablet PC Edition (SP2/SP1)
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The design of the mobile 945 Express came from a solid foundation and it's goal is higher performance, longer battery life, and versatile connectivity on the go. A perfect solution for businesses, gaming, media creation, office productivity, and anyone who are hungry for performance but concern about weight and power consumption.
>> Intel Mobile 945 Express Matrix Chart <<
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Intel PRO/Wireless 3945ABG Network Connection

The form factor of Intel PRO/Wireless 3945ABG has been redesigned to a new shape known as Mini-Card, which is less than half the size of last year 2915ABG Mini-PCI card, thus helping to enable the "thin-and-light" notebook designation. The dimensions are 1.181" x 2.01" (30 x 51 mm).  The 3945ABG aka "Golan" is the first Intel Wireless LAN model to take full advantage of the PCI Express bus rather than the old standard PCI bus. The PCI Express bus specification for PCI Express Mini-Card socket in a notebook must support both an x1 PCI Express link and a USB2.0 link.  This feature allow PRO/Wireless 3945ABG to use x1 PCIe link, USB2.0 link, or both links to communicate with the system. Enable robust network connectivity and reduces down-time for everyone to enjoy.
The Intel® PRO/Wireless 3945ABG Network Connection is an embedded 802.11a/b/g PCIe Mini Card network adapter operating in the 2.4GHz and 5GHz spectrum. The new solution support for the latest wireless industry standards, and offers many features that bring mobile a new lifestyle.
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Key Features:
  • 802.11e QoS with enhancements for VoIP
  • Noise Interference filter enhances performance especially in areas with wireless signal overlap
  • Wake on WLAN support allows waking up a notebook remotely and distributing upgrades and patches
  • Business Class Wireless Suite offering Enhanced VoIP quality technology and optimal AP selection technology
  • Intel PROSet/Wireless Software v10.1 with a new IT Administrator toolkit and GUI enhancements that simplify connecting to WLAN networks
  • Advanced Roaming and AP selection algorithms base on link quality parameters
  • IEEE 802311b up to 11MBPs and 80211a/g up to 54Mbs data rates
  • Industry standard wireless LAN security is provided (802.11i,802.1x, WEP, WPA, WPA2, AES)
  • Cisco Compatible Extensions v4 support available on certain models.
  • Support for antenna diversity enables optimized WLAN performance for multi-antenna systems
  • Intel Wireless Coexistence System capability enables Bluetooth co-existence
 Intel® PRO/Wireless 3945ABG Network Connection (Tri-mode 802.11a/b/g)
Features Benefits
Wi-Fi CERTIFIED Wi-Fi CERTIFIED for 2.4 GHz and 5 GHz band, WPA and WPA2
Operating Frequency > 5 GHz UNII: Orthogonal Frequency Division Multiplexing (OFDM) for 802.11a
> 2.4 GHz ISM: Direct Sequence Spread Spectrum (DSSS) for 802.11b
> 2.4 GHz ISM: Orthogonal Frequency Division (OFDM) for 802.11g
Performance Typical indoor range of 40 ft (12 m) @ 54 Mbps / 300 ft (91 m) @ 6 Mbps for 802.11a, 100 ft (30 m) @ 11 Mbps / 300 ft (90 m) @ 1 Mbps for 802.11b, 100 ft (30 m) @ 54 Mbps / 300 ft (91 m) @ 1 Mbps for 802.11g

Intel® Wireless Coexistence System support enables reduced interference between Intel PRO/Wireless & certain Bluetooth devices.

For systems designed with two antennas, real-time antenna selection enables optimized WLAN performance.

Real-time temperature calibration dynamically optimizes wireless performance by adjusting output power to temperature changes for increased throughput & range with 802.11a radio.
Intel® PROSet Software v10.1
  • Business Class Wireless Suite with Enhanced VoIP Quality Technology and Optimal AP Selection Technology
  • Cisco Compatible Extensions v4
  • Wake on WLAN
  • Easy-to-use interface with Intel® Smart Wireless Solutions support
  • IT Administrator Tool with Single Sign On support, Centralized Profile Management and Install Package Creator
  • EAP-SIM support
Power Management Intel® Intelligent Scanning Technology reduces power by controlling the frequency of scanning for access points

A user selectable feature with five different Power states, which allows the user to make their own power vs. performance choices when in battery mode
Supported Operating Systems Microsoft Windows XP (Professional, Home, Tablet)
Microsoft Windows 2000
Other Intel PRO/Wireless 3945ABG User Guide
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Intel's new logo for Centrino Duo platform

Intel is taking a big leap ahead from it's competitors in this year of 2006.  With the new redesign of last year Centrino mobile to Centrino Duo it is obvious that a new logo is necessary to spice up the new technology. The new Centrino logo looks lighter and have curve.  The Centrino Duo logo is an authentication for Core Duo "Yonah" microprocessors and Centrino logo is an authentication for Solo "Yonah" microprocessors. The simple equation below distinguishes what Centrino logo to use for notebook builder.
New Mobile Processor Type   Intel® 945PM/GM Express Chipset   Intel PRO/Wireless 3945ABG card = Centrino Certified Logo
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